Tokyo Seimitsu Co., Ltd.

Shozo Katamachi

Shinji Shibaoka

Ichiro Katayama

Shigeru Okubo

The invention provides a circularity and cylindrical shape measuring device that can decrease the measurement errors generated due to the weight of a measured workpiece. A circularity and cylindrical shape measuring device () is configured such that a rotation axis of a rotary table () is positioned on a leg () that supports a base table () or is positioned on a straight line that connects adjacent legs (A andB)

Device for measuring circularity and cylindrical shape

A work piece such as a semiconductor ingot is positioned and bonded to a work piece bonding block by a bonding jig which is provided separately from a wire saw in such a manner that the central axis of the work piece and respective horizontal and vertical surfaces of the work piece bonding block come into parallel to each other. Then, the work piece bonding block is positioned and mounted at a mounting jig which is provided on a cutting-feeding table of the wire saw and which has horizontal and vertical reference surfaces perpendicularly intersecting a cutting plane, so that the central axis of the work piece automatically and perpendicularly intersects the cutting plane. Then, the mounting jig is tilted to tilt the work piece by a tilting mechanism in such a manner that the central axis is inclined against the cutting plane at a predetermined angle on the basis of shift value data of the crystal orientation with the central axis of the work piece a reference, which has previously been measured outside the wire saw.

Method of positioning work piece and system therefor

An opening for loading and unloading ingots is formed at the top of a cover, which covers a processing chamber wherein grooved rollers of a wire saw are disposed. The ingots are exchanged from above the cover through the opening. Even if a plurality of wire saws are arranged at short intervals, the adjacent wire saws can exchange the ingots at the same time, Thus, the ingots can be exchanged efficiently.

Wire saw for slicing brittle materials with an ingot loading and

The moving direction of the wire line 15A at the cut portion 44 for cutting the columnar semiconductor ingot 18 corresponds to the vertical-downward direction. And, the semiconductor ingot 18 supported with the cut-feed means 20 is fed horizontally so as to be pushed in perpendicular to said wire line 15A, and the processing liquid 42 is supplied to the wire line 15A from the grind liquid supply nozzle 40 placed at the upper side of the cut portion 44. Therefore, the processing liquid 42 supplied to the wire line 15A flows along the wire line 15A, so that the processing liquid 42 can be surely supplied to the cut portion 44.

Wafer cut method with wire saw apparatus and apparatus thereof

A microswitch is provided near each end of each grooved roller. The microswitch has a rod-shaped contact shoe, and is operated if a wire derailed from the grooved roller contacts the contact shoe. An operational signal is sent from the microswitch to a control apparatus, and the control apparatus receives the operational signal so as to detect that the wire is derailed.

Wire derailment detecting apparatus of wire saw

A turn table is connected to a rotary shaft of a driving motor for driving a wire reel coaxially therewith. The wire reel is connected onto this turn table. With this arrangement, the wire reel is directly driven by the driving motor. Accordingly, the period of time needed for acceleration or deceleration for the driving motor can be shortened, so that through-put can be improved. Furthermore, for the driving motor, a motor being low in inertia, i.e., a small-sized motor can be used, so that a driving section can be made compact in size. Further, a space for a belt transmission mechanism, which has heretofore been necessary, can be saved, so that the driving section can be made compact in size.

Wire saw

A work piece such as a semiconductor ingot is positioned and bonded to a work piece bonding block by means of a bonding jig which is provided separately from a wire saw in such a manner that the central axis of the work piece and respective horizontal and vertical surfaces of the work piece bonding block come into parallel to each other. Then, the work piece bonding block is positioned and mounted at a mounting jig which is provided on a cutting-feeding table of the wire saw and which has horizontal and vertical reference surfaces perpendicularly intersecting a cutting plane, so that the central axis of the work piece automatically and perpendicularly intersects the cutting plane. Then, the mounting jig is tilted to tilt the work piece by a tilting mechanism in such a manner that the central axis is inclined against the cutting plane at a predetermined angle on the basis of shift value data of the crystal orientation with the central axis of the work piece a reference, which has previously been measured outside the wire saw.

Wire derailment detecting apparatus for wire saw

A wire is put on a guide roller, which guides the wire in a direction of a wire reel's axis. A wire load, which changes according to the displacement of the supply angle of the wire on the guide roller, is detected sequentially. Then, the guiding speed of the guide roller is sequentially controlled to adjust the wire displacement. Therefore, when the displacement of the wire supply angle changes, the guiding speed of the wire can quickly respond to the change.

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Mitaka, Japan

Shozo Katamachi