Panasonic Intellectual Property Management Co., Ltd.

Shoya Kida

Takeshi Uemura

Hiroshi Nakatsuka

Hideki Ueda

Hideaki Fujiura

Ryota Sudo

Tsuyoshi Sakaue

Naoki Kobayashi

Nobuaki Shimamoto

Yuki Maegawa

Rie Okamoto

Nayuta Minami

An infrared processing system includes a first thermal image generating unit, an object extracting unit, a second thermal image generating unit, and an object temperature calculating unit. The first thermal image generating unit generates, using a first temperature correction value, a first thermal image based on the output signal of the image sensor. The object extracting unit extracts the object from the first thermal image. The second thermal image generating unit generates, using a second temperature correction value corresponding to the object that has been extracted by the object extracting unit, a second thermal image based on the output signal of the image sensor. The object temperature calculating unit calculates, based on the second thermal image that has been generated by the second thermal image generating unit, a temperature of the object that has been extracted by the object extracting unit.

Infrared processing system, infrared sensor system, infrared processing method, and program

A sensor includes a sensor element, a package accommodating the sensor element in an inside of the package, a grounding electrode disposed in the package, a lid covering an opening of the package, and a lead extending from the package. The lead includes first and second portions. The first portion of the lead is electrically connected to the grounding electrode and extends along a side surface of the package with a gap provided between the first portion and the side surface. The second portion of the lead is disposed between the lid and the package and extends toward the inside of the package. In this sensor, the opening can be sealed without soldering and reliably connect the lid to the grounding electrode.

Sensor

Growing community of inventors

Fukui, Japan

Shoya Kida