Cemedine Co., Ltd.

Shouma Kouno

Naomi Okamura

Hiroshi Yamaga

Atsushi Saito

Tomohiro Midorikawa

Provided is a method of producing a pressure-sensitive adhesive containing a cured product of a curable composition containing a crosslinkable silicon group-containing organic polymer and an adhesion-imparting resin as a pressure-sensitive adhesive layer; curing of the curable composition does not proceed when heated during production, i.e., the curable composition has excellent stability when heated, and the crosslinking reaction of the curable composition proceeds by some sort of trigger. The pressure-sensitive adhesive contains, as a pressure-sensitive adhesive layer, a cured product of a curable composition containing (A) a crosslinkable silicon group-containing organic polymer, (B) an adhesion-imparting resin, (C) a Si&#x2014;F bond-containing silicon compound, and (D) a photobase generator.

Pressure-sensitive adhesive

The present invention provides a curable composition containing an organic polymer having a crosslinkable silicon group, the composition having sufficient usable life and having adhesive properties with respect to an adherend (substrate) that are equivalent to those of the case where aminosilane is included. The composition comprises: (A) a crosslinkable silicon group-containing organic polymer; and (B) a crosslinkable silicon group-containing compound that forms, by means of light, at least one type of amino group selected from the group consisting of primary amino groups and secondary amino groups. The crosslinkable silicon group-containing organic polymer (A) is preferably at least one type selected from the group consisting of crosslinkable silicon group-containing polyoxyalkylene polymers and crosslinkable silicon group-containing (meth)acrylic-based polymers.

Growing community of inventors

Tokyo, Japan

Shouma Kouno