Tokyo Electron Limited

Shouichi Otake

Hiroshi Nakamura

Masahiro Numakura

Yoshikazu Ishikawa

Junya Sato

Toshiyuki Kobayashi

Wataru Nakagomi

Toshihiko Hamada

A substrate processing apparatus includes at least one process module configured to process first substrates. A position detector is configured to detect first positions of the first substrates. A control unit is configured to control the position detector so as to measure a second position of a second substrate selected from the first substrates to be processed in a same process module depending on a measurement interval set for the same process module.

Substrate processing apparatus, substrate processing method and recording medium recording substrate processing program

A processing systemapplies an etching process on a wafer W in a PMor PM. An ECincludes functions of a transfer/process control unit, a communication unit, a log management unit, and a backup unit, and controls the processing system. The transfer/process control unitcontrols wafer transfer and the etching process. The communication unittransmits to or receives data from each MCand the like. The log management unitregisters log information generated at times of the wafer process and transfer, data communication, and the like in log files (in predetermined storage areas of an HDD). The backup unitcollectively saves the log information stored in the log files in backup files (in other storage areas of the HDD), in response to a timing when an unexpected alarm has been generated.

System, method and storage medium for controlling a processing system

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Miyagi, Japan

Shouichi Otake