Light To Form, LLC

Shoubert Makanoeich

Eric Bretschneider

Nelson Caldani

A LED device is disclosed. The device has a LED area, a boundary element surrounding the LED area, a plurality of chip scale package LEDs in the LED area, a plurality of flip chip LEDs in the LED area, an encapsulate, a first conductive path, and a second conductive. The encapsulate covers the plurality of chip scale package LEDs and the plurality of flip chip LEDs in the LED area. The encapsulate has phosphor. The first conductive path connects the plurality of chip scale package LEDs. The second conductive path connects the plurality of flip chip LEDs. The plurality of chip scale package LEDs and the plurality of flip chip LEDs in the LED area are arranged in rows. Each row comprises alternating chip scale package LEDs and flip chip LEDs.

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Saint Charles, IL, United States of America

Shoubert Makanoeich