Anpec Electronics Corporation

Taiwan Semiconductor Manufacturing Comp. Ltd.

Shou-Yi Hsu

Yung-Fa Lin

Meng-Wei Wu

Chia-Hao Chang

Main-Gwo Chen

Yi-Chun Shih

Chia-Wei Chen

Hon-Hung Lui

Yi-Lin Sun

Kun-Jung Chuang

Yi-Te Chen

Jing-Qing Chan

Kuen-Hsien Lin

Yu-Zung Chiou

Chen Ying Lieh

The present invention provides a power transistor device with a super junction including a substrate, a first epitaxial layer, a second epitaxial layer, and a third epitaxial layer. The first epitaxial layer is disposed on the substrate, and has a plurality of trenches. The trenches are filled up with the second epitaxial layer, and a top surface of the second epitaxial layer is higher than a top surface of the first epitaxial layer. The second epitaxial layer has a plurality of through holes penetrating through the second epitaxial layer and disposed on the first epitaxial layer. The second epitaxial layer and the first epitaxial layer have different conductivity types. The through holes are filled up with the third epitaxial layer, and the third epitaxial layer is in contact with the first epitaxial layer. The third epitaxial layer and the first epitaxial layer have the same conductivity type.

Power transistor device with super junction

The present invention provides a manufacturing method of a trench type power transistor device with a super junction. First, a substrate of a first conductivity type is provided, and then an epitaxial layer of a second conductive type is formed on the substrate. Next, a through hole is formed in the epitaxial layer, and the through hole penetrates through the epitaxial layer. Two doped drain regions of the first conductivity type are then formed in the epitaxial layer respectively at two sides of the through hole, and the doped drain regions extend from a top surface of the epitaxial layer to be in contact with the substrate.

Manufacturing method of trench type power transistor device with super junction

The present invention provides a trench type power transistor device including a substrate, an epitaxial layer, a doped diffusion region, a doped source region, and a gate structure. The substrate, the doped diffusion region, and the doped source region have a first conductivity type, and the substrate has an active region and a termination region. The epitaxial layer is disposed on the substrate, and has a second conductivity type. The epitaxial layer has a through hole disposed in the active region. The doped diffusion region is disposed in the epitaxial layer at a side of the through hole, and is in contact with the substrate. The doped source region is disposed in the epitaxial layer disposed right on the doped diffusion region, and the gate structure is disposed in the through hole between the doped diffusion region and the doped source region.

Method for fabricating trench type power transistor device

Manufacturing method of power transistor device with super junction

Trench type power transistor device with super junction

A semiconductor device includes: a substrate including a first epitaxial layer that has a first electrical type, and a second epitaxial layer; a transistor that includes a source region and an insulating spacer; an inner surrounding structure including an annular trench and an insulating spacer; an outer surrounding structure that has a second electrical type opposite to the first electrical type, and that is disposed adjacent to an upper surface of the second epitaxial layer to surround and contact the inner surrounding structure; and a conductive structure connecting to the source region, and the inner and outer surrounding structures.

Semiconductor device

A method of fabricating a super junction transistor is provided. A drain substrate is provided. An epitaxial layer is formed on the drain substrate. A plurality of trenches is formed in the epitaxial layer. A buffer layer is formed and is in direct contact with the interior surface of the trenches. A dopant source layer is filled into the trenches. An etching process is performed to form a plurality of recessed structures above the respective trenches. A gate oxide layer is formed on the surface of each recessed trench and the dopants inside the dopant source layer are diffused into the epitaxial layer through the buffer layer to thereby form at least a body diffusion layer of the first conductivity type. A gate conductor is filled into the recessed structures to form a plurality of gate structure units. A doped source region having the first conductivity type is formed.

Method of fabricating a super junction transistor

The present invention provides a manufacturing method of a power transistor device. First, a semiconductor substrate of a first conductivity type is provided, and at least one trench is formed in the semiconductor substrate. Next, the trench is filled with a dopant source layer, and a first thermal drive-in process is performed to form two doped diffusion regions of a second conductivity type in the semiconductor substrate, wherein the doping concentration of each doped diffusion region close to the trench is different from the one of each doped diffusion region far from the trench. Then, the dopant source layer is removed and a tilt-angle ion implantation process and a second thermal drive-in process are performed to adjust the doping concentration of each doped diffusion region close to the trench.

The present invention provides a power transistor device including a substrate, an epitaxial layer, a dopant source layer, a doped drain region, a first insulating layer, a gate structure, a second insulating layer, a doped source region, and a metal layer. The substrate, the doped drain region, and the doped source region have a first conductive type, while the epitaxial layer has a second conductive type. The epitaxial layer is formed on the substrate and has at least one through hole through the epitaxial layer. The first insulating layer, the gate structure, and the second insulating layer are formed sequentially on the substrate in the through hole. The doped drain region and doped source region are formed in the epitaxial layer at one side of the through hole. The metal layer is formed on the epitaxial layer and extends into the through hole to contact the doped source region.

Power transistor device

A super junction transistor includes a drain substrate, an epitaxial layer, wherein the epitaxial layer is disposed on the drain substrate, a plurality of gate structure units embedded on the surface of the epitaxial layer, a plurality of trenches disposed in the epitaxial layer between the drain substrate and the gate structure units, a buffer layer in direct contact with the inner surface of the trenches, a plurality of body diffusion regions with a first conductivity type adjacent to the outer surface of the trenches, wherein there is at least a PN junction on the interface between the body diffusion region and the epitaxial layer, and a doped source region, wherein the doped source region is disposed in the epitaxial layer and is adjacent to the gate structure unit.

Super junction transistor and fabrication method thereof

A method for fabricating a super-junction semiconductor power device with reduced Miller capacitance includes the following steps. An N-type substrate is provided and a P-type epitaxial layer is formed on the N-type substrate. At least a trench is formed in the P-type epitaxial layer followed by forming a buffer layer on interior surface in the trench. An N-type dopant layer is filled into the trench and then the N-type dopant layer is etched to form a recessed structure at an upper portion of the trench. A gate oxide layer is formed, and simultaneously, dopants in the N-type dopant layer diffuse into the P-type epitaxial layer, forming an N-type diffusion layer. Finally, a gate conductor is filled into the recessed structure and an N-type source doped region is formed around the gate conductor in the P-type epitaxial layer.

Method for fabricating super-junction power device with reduced miller capacitance

A method for fabricating a semiconductor power device includes the following steps. First, a substrate having thereon at least a semiconductor layer and a pad layer is provided. Then, at least a trench is etched into the pad layer and the semiconductor layer followed by depositing a dopant source layer in the trench and on the pad layer. A process is carried out thermally driving in dopants of the dopant source layer into the semiconductor layer. A rapid thermal process is performed to mend defects in the dopant source layer and defects between the dopant source layer and the semiconductor layer. Finally, a polishing process is performed to remove the dopant source layer from a surface of the pad layer.

Method for fabricating semiconductor power device

A method for fabricating a semiconductor power device includes the following steps. First, a substrate having at least a semiconductor layer and a pad layer thereon is provided. At least a trench is etched into the pad layer and the semiconductor layer. Then, a dopant source layer is deposited in the trench and on the pad layer followed by thermally driving in dopants of the dopant source layer into the semiconductor layer. A polishing process is performed to remove the dopant source layer from a surface of the pad layer and a thermal oxidation process is performed to eliminate micro-scratches formed during the polishing process. Finally, the pad layer is removed to expose the semiconductor layer.

Growing community of inventors

Hsinchu County, Taiwan

Shou-Yi Hsu