Realtek Semiconductor Inc.

Shou-Te Yen

Chao-Min Lai

Ping-Chia Wang

Guo-Yuan Luo

Yan-Jyun Chen

A method for electrostatic discharge protection in a receiver and associated receiver are provided. The receiver includes a reference voltage terminal, a detection terminal, at least one set of receiving terminals and at least one set of termination resistors. The method includes: according to a voltage level of the detection terminal, generating a detection result; and according to the detection result, controlling whether to configure said at least one set of termination resistors to be respectively coupled between said at least one set of receiving terminals and the reference voltage terminal.

Method for electrostatic discharge protection in receiver and associated receiver

A signal processing circuit includes: a printed circuit board (PCB) including a first surface layer, a second surface layer, a first reference layer, and a second reference layer, wherein the first and second surface layers are positioned on opposing side of the PCB while the first reference layer and the second reference layer are positioned between the first and second surface layers; a memory chip positioned on the first surface layer; a controller chip positioned on the second surface layer; a first set of signal lines arranged on the first surface layer and coupled with the memory chip, wherein all signal lines in the first set of signal lines does not cross each other; and a second set of signal lines arranged on the second surface layer and coupled with the controller chip, wherein all signal lines in the second set of signal lines does not cross each other.

Signal processing circuit capable of avoiding cooperating memory chip from performance degradation

An electronic apparatus and a circuit board thereof are provided. The electronic apparatus operates in cooperation with a packaged electronic component. The electronic apparatus includes a circuit board and a control device disposed on the circuit board. The circuit board includes a plurality of conductive vias passing therethrough, and the conductive vias includes a plurality of first conductive vias arranged respectively corresponding to the first contact pads of the packaged electronic component. The control device includes a signal contact array including a plurality of first signal contacts. When the packaged electronic component and the control device are respectively disposed on two opposite sides of the circuit board, the packaged electronic component and the control device at least partially overlap in a thickness direction of the circuit board, and the first signal contacts are respectively electrically connected to the first contact pads via the corresponding conductive vias.

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Hsinchu County, Taiwan

Shou-Te Yen