Zhen Ding Technology Co., Ltd.

Industrial Technology Research Institute

Shou-Jui Hsiang

Szu-Hsiang Su

Mao-Feng Hsu

Ming-Jaan Ho

Kuan-Wei Lee

Pei-Jung Wu

Chen-Feng Yen

Wei-Hsin Huang

Nan-Kun Huang

Yu-Wen Kao

Chi-Fei Huang

Chia-Yin Teng

Ching-Hsuan Lin

Yen-Chin Hsiao

Chang-Hung Lee

Wei-Ta Yang

Sheng-Feng Chung

Kuo-Sheng Liang

Si-Yi Chin

Hong-Ping Lin

Yi-Fang Lin

A block copolymer of polyamide acid includes a first polyamide acid and a second polyamide acid alternately connected. The first polyamide acid is made by first dianhydride monomers and second diamine monomers. The second polyamide acid is made by second dianhydride monomers and first diamine monomers. Each first dianhydride monomer is or comprises a liquid crystal structure. Each second dianhydride monomer and each second diamine monomer respectively include a first flexible structure. Each first diamine monomer includes a liquid crystal structure. Each liquid crystal structure includes a cyclic group selected from a chemical structural formula of and intermediate groups selected from a chemical structural formula of Each flexible structure includes a group selected from a group consist of ether bond, ketone group, sulphone group, aliphatic hydrocarbon group, and any combination thereof.

Method for manufacturing a block copolymer of polyamide acid

A polymer dispersion is disclosed. The polymer dispersion includes a liquid crystal polymer powder, a polyamide acid, and a solvent. A solid content of the polymer dispersion includes the liquid crystal polymer powder and the polyamide acid. The liquid crystal polymer powder has a mass ratio of 20% to 30% in the solid content. The polyamide acid has a mass ratio of 70% to 80% in the solid content. The polyamide acid is obtained by mixing two kinds of diamines and two kinds of dianhydrides together, causing the diamines and the dianhydrides to be polymerized with each other. Both two kinds of diamines and two kinds of dianhydrides comprise a liquid crystal structure and a flexible structure respectively. A method of preparing the polymer dispersion, and a method for preparing a polymer composite film using the polymer dispersion are also disclosed.

Polymer dispersion, method for manufacturing the polymer dispersion, and method for manufacturing polymer composite film

A transparent polyimide mixture is disclosed. The transparent polyimide mixture includes a transparent polyimide, an additive, and a solvent. A molecular chain of the transparent polyimide includes an active hydrogen atom. The additive includes a carbodiimide group. An equivalent ratio of the active hydrogen atom and the carbodiimide group is in a range of 1:0.8 to 1:1.2. A method for preparing the transparent polyimide mixture, a transparent polyimide film, and a method for preparing a transparent polyimide film are also disclosed.

Transparent polyimide mixture, method for manufacturing the transparent polyimide mixture, and method for manufacturing transparent polyimide film

A composite fabric which is elastic and conductive and thus able to detect a user's limb and body movements includes a fabric layer and an elastic conductive layer of elastomer and conductive filler formed on the fabric layer. A resistance value and a strain increments of the fabric satisfy a relationship of R=R+n&#x3b5; or R=R+m e, wherein &#x3b5; denotes the strain increment, R denotes the resistance value when the strain increment is 0, and Rdenotes the resistance value when deformed through the increments. The m and n are coefficients, being a whole number or a fraction. A user can immediately detect and know the movements of his limbs according to the resistance value of the elastic conductive composite fabric.

Elastic conductive composite fabric capable of detecting and providing electrical signals according to reflections of limbs and body movements

A method for manufacturing a thick polyimide film includes providing a first and second laminated structures. The first and second laminated structures are heated, and the heated first and second laminated structures are wound together to form a third laminated structure. The first polyamic acid gel film of the heated first laminated structure and the second polyamic acid gel film of the heated second laminated structure are overlapped and bonded together to form a third polyamic acid gel film. Two third laminated structures are wound together to form a fourth polyamic acid gel film. A dehydration ring-closure imidization reaction is applied to the fourth polyamic acid gel film by heating to obtain the thick polyimide film. A thick polyimide film manufactured by the method is also disclosed.

Method for manufacturing thick polyimide film

A circuit board includes an insulating made by a low dielectric resin composition includes a low dielectric resin containing acid anhydride, an epoxy resin, polyphenylene ether resin with vinyl and active esters, maleic acid liquid polybutadiene, and an accelerator. Such low dielectric resin can be dissolved in organic solvent more easily than a low dielectric resin without acid anhydride, and the low dielectric resin containing acid anhydride has a better compatibility with other organic components than a low dielectric resin without acid anhydride. A low dielectric resin composition with lower dielectric constant and better properties can thus be obtained.

Circuit board using low dielectric resin composition

A photosensitive resin composition comprises a modified polyimide polymer having a chemical structural formula of: photosensitive monomers, a bisphenol A epoxy resin, a photo-initiator, and a pigment. The modified polyimide polymer is made by a reaction of a polyimide polymer having a chemical structural formula of: and glycidyl methacrylate. The carboxyl group of the polyimide polymer reacts with the epoxy group of glycidyl methacrylate. The polyimide polymer is made by a reaction of dianhydride monomers each having an A group, diamine monomers each having the R group, diamine monomers each having the Rgroup, and diamine monomers each having the Rgroup. The diamine monomer having R group is a diamine compound having R group bonding with the carboxyl group. The diamine monomer having Rgroup is a soft long-chain diamine monomer. Rgroup comprises at least one secondary amine group or tertiary amine group.

Photosensitive resin composition, and polymer film made therefrom

A low dielectric resin composition comprises a low dielectric resin containing acid anhydride, an epoxy resin, a rigid cross-linking agent, a soft cross-linking agent, and an accelerator. Such low dielectric resin can be dissolved in organic solvent more easily than a low dielectric resin without acid anhydride, and the low dielectric resin containing acid anhydride has a better compatibility with other organic components than a low dielectric resin without acid anhydride. A low dielectric resin composition with lower dielectric constant and better properties can thus be obtained. A film and a circuit board using such resin composition are also provided.

Low dielectric resin composition, film and circuit board using the same

An inorganic shell is ball-shaped and hollow, and includes silica and crystalline inorganic powder sintered together. A resin composition has the inorganic shells and the resin composition has certain dieletric characteristics. A method for making the inorganic shell is also provided.

Inorganic shell, resin composition, and method for making inorganic shell

A low dielectric polyimide composition comprises an aliphatic anhydride, a long chain diamine, and an ester diamine. A polyimide made of such low dielectric polyimide composition has low polarizability group, thus the dielectric constant of the polyimide is lower. A polyimide made of the low dielectric polyimide composition, a polyimide film using the polyimide, and a copper clad laminate using the polyimide film are also provided.

Low dielectric polyimide composition, polyimide, polyimide film and copper clad laminate using the same

A resin composition comprises a modified polyimide compound, an epoxy resin, and a solvent. The modified polyimide compound has a chemical structural formula of the Ar' represents a group selected from a group consisting of phenyl having a chemical structural formula of diphenyl ether having a chemical structural formula of biphenyl having a chemical structural formula of hexafluoro-2,2-diphenylpropane having a chemical structural formula of benzophenone having a chemical structural formula of and diphenyl sulfone having a chemical structural formula of and any combination thereof, the modified polyimide compound has a degree of polymerization n of about 1 to about 50, the epoxy resin and the modified polyimide compound are in a molar ratio of about 0.1:1 to about 1:1. A modified polyimide compound and a polyimide film are also provided.

Modified polyimide compound, resin composition and polyimide film

A resin composition comprises a modified polyimide compound, an epoxy resin, and a solvent. The modified polyimide compound has a chemical structural formula of the Ar' represents a group selected from a group consisting of phenyl having a chemical structural formula of diphenyl ether having a chemical structural formula of biphenyl having a chemical structural formula hexafluoro-2,2-diphenylpropane having a chemical structural formula of benzophenone having a chemical structural formula of and diphenyl sulfone having a chemical structural formula of and any combination thereof, the epoxy resin and the modified polyimide compound are in a molar ratio of about 0.1:1 to about 1:1. A polyimide film and a method for manufacturing the polyimide film using the resin composition are also provided.

Resin composition, polyimide film and method for manufacturing polyimide film

A non-toxic water soluble photosensitive resin composition able to function as a solder mask coating comprises a polymer containing oxazolinyl, a photosensitive monomer, and a photo-initiator. These elements are all water soluble or water dispersible. The polymer containing oxazolinyl and the photosensitive monomer have a plurality of carbon-carbon double bonds. The polymer containing oxazolinyl and the photosensitive monomer are polymerized to form a dense cross-linking network structure when the water soluble photosensitive resin composition is exposed to ultraviolet radiation. A film using the water soluble photosensitive resin composition is also provided.

Water soluble photosensitive resin composition and film using same

A non-reactive photosensitive resin composition storable at room temperature comprises a carboxylic acid-modified bisphenol epoxy (meth)acrylate, a photosensitive monomer, a photosensitive prepolymer, a photo-initiator, and a coloring agent. Each of the carboxylic acid-modified bisphenol epoxy (meth)acrylate, photosensitive monomer, and photosensitive prepolymer has a plurality of carbon-carbon double bonds, so that the carboxylic acid-modified bisphenol epoxy (meth)acrylate, photosensitive monomer and photosensitive prepolymer may be polymerized to form a dense cross-linking network structure when the photosensitive resin composition is exposed to ultraviolet radiation. A film and a printed circuit board using the photosensitive resin composition are also provided.

Photosensitive resin composition, and film and printed circuit board using same

Disclosed is a method of fabricating a graphite sheet, including: polymerizing diamines and a dianhydride to form a polyamic acid. The polyamic acid is solvent casted on a substrate and hot baked to form a polyamic acid film or gel film. The polyamic acid film or gel film is biaxially stretched at a high temperature imidization or chemical imidization to form the polyimide film. The polyimide film is then carbonized and graphitized to form a graphite sheet. The diamines include a diamine of Formula 1 and a diamine of Formula 2, and the dianhydride includes a dianhydride of Formulae 3, Formula 4, Formula 5, Formula 6, Formula 7, Formula 8, Formula 9, or combinations thereof. 

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Taoyuan, Taiwan

Shou-Jui Hsiang