Toyota Jidosha Kabushiki Kaisha

Shou Funano

Takuya Kadoguchi

Shingo Iwasaki

Satoshi Takahagi

Atsuko Yamanaka

Yuuji Hanaki

A method of manufacturing a semiconductor device that includes a resin package sealing a semiconductor element and a pair of metal plates interposing the semiconductor element therebetween, in which each of the pair of metal plates is exposed at corresponding one of both surfaces of the resin package is disclosed. The method may include preparing an assembly in which the semiconductor element is connected to the pair of metal plates; setting the assembly in a cavity of a mold, wherein one metal plate is in contact with a bottom surface of the cavity and a space is provided above the other metal plate; forming the resin package by injecting a molten resin into the cavity so as to cover an upper side of the other metal plate, stopping the injecting of the molten resin with a part of the space on an upper side of the cavity unfilled.

Growing community of inventors

Toyota, Japan

Shou Funano