Screen Holdings Co., Ltd.

Shotaro Tsuda

Hiroki Tsujikawa

Junichi Ishii

Nobuaki Okita

Keiji Iwata

Nobuyasu Hiraoka

Takayuki Nishida

Seiji Ano

Ryohei Hokaku

A substrate cleaning device includes a substrate holder that holds a substrate, a cleaning brush that is provided to be movable between a cleaning position for cleaning the substrate held by the substrate holder and a waiting position outward of the substrate held by the substrate holder, and has a cleaning surface capable of cleaning the substrate held by the substrate holder, a remover that is configured such that liquid is transferrable to the remover, and a driver that moves at least one of the cleaning brush and the remover with respect to another one such that at least part of liquid adhering to the cleaning surface is transferred to the remover when the cleaning surface and the remover come close to each other at a position outward of a position above the substrate held by the substrate holder, before the substrate is cleaned by the cleaning brush.

Substrate cleaning device and substrate cleaning method

A substrate processing apparatus includes an upper cup part including a first tubular portion and a second tubular portion that are formed each in a tubular shape capable of surrounding a substrate held by a substrate holder, the second tubular portion being connected to an upper side of the first tubular portion. The substrate processing apparatus also includes a cup moving unit that moves the upper cup part in a vertical direction with respect to the substrate holder to stop the upper cup part at each of a position where the first tubular portion surrounds the substrate, and a position where the second tubular portion surrounds the substrate.

Substrate processing apparatus and substrate processing method

In parallel with a lower-side scrub cleaning step where a brush is contacted with a lower surface inclined portion of a substrate, a center-side spray cleaning step is performed where a collision position of liquid droplets with respect to an upper surface of the substrate is moved between the center of the substrate and the middle of the substrate while the liquid droplets collide with the upper surface of the substrate. Thereafter, in parallel with an upper-side scrub cleaning step where the brush is contacted with an upper surface inclined portion of the substrate, an outer circumference-side spray cleaning step is performed where the collision position of the liquid droplets with respect to the upper surface of the substrate is moved between the middle of the substrate and the outer circumference of the substrate while the liquid droplets collide with the upper surface of the substrate.

Substrate treatment method and substrate treatment device

A substrate treatment method is used for removing a resist from a front surface of a substrate. A substrate treatment apparatus includes a substrate holding unit which holds the substrate, and a sulfuric acid ozone/water mixture supplying unit which supplies a sulfuric acid ozone/water mixture to the front surface of the substrate held by the substrate holding unit, the sulfuric acid ozone/water mixture being a mixture which is prepared by a method including mixing water with sulfuric acid ozone prepared by dissolving ozone gas in sulfuric acid.

Growing community of inventors

Kyoto, Japan

Shotaro Tsuda