Taiyo Yuden Co., Ltd.

Shota Yajima

Toshiya Kuji

Takashi Sasaki

Motoki Kobayashi

Yasutomo Suga

Masataka Watabe

Tomohiko Zaima

Fukio Kinoshita

Yuji Hoshi

A multi-layer ceramic electronic component includes a ceramic body enclosing internal electrodes laminated in a first direction, wherein the ceramic body has a main surface having a flat face normal to the first direction, a first side surface having a flat face normal to a second direction orthogonal to the first direction, and a rounded ridge connecting the main surface and the first side surface to each other and curved in a convex shape; a maximum dimension of the ceramic body in the first direction is 120 &#x3bc;m or less; and the rounded ridge satisfies a condition of Rb/Ra&#x3e;3.0, where Ra represents a dimension of the rounded ridge in the first direction and Rb represents a dimension of the rounded ridge in the second direction on a cross-sectional surface of the ceramic body taken along a virtual cut plane parallel to the first direction and the second direction.

Multi-layer ceramic electronic component and mounting board

Disclosed is a ceramic electronic component having external electrodes on each of opposed end portions of a rectangular parallelepiped component body. A first direction dimension, a second direction dimension and a third direction dimension of the component body satisfy a condition of second direction dimension&#x3e;first direction dimension&#x3e;third direction dimension. The external electrodes are of a five-face type having a first face portion, a second face portion, a third face portion, a fourth face portion and a fifth face portion. At least one edge of the fourth face portion and the fifth face portion of the external electrode has a recess portion recessed from the edge toward the first face portion. Both side portions in the third direction of the recess portion are covering portions which cover ridge portions of the two faces in the second direction of the component body.

Ceramic electronic component, ceramic electronic component manufacturing method, and ceramic electronic component-mounting circuit board

In an embodiment, a multilayer ceramic capacitorhas a first external electrodehaving a second part, and a second external electrodehaving a second part, and each second part have an external shape where length Lbecomes the largest at a width-direction center portionorand length Lbecomes the smallest at a width-direction edgeor, with the length decreasing gradually from the width-direction center portionorto the width-direction edgeor

Multilayer ceramic capacitor

A mounting structure of a chip component includes a chip component that is bonded by having a pair of external terminal electrodes provided on both ends of an element body of the thin chip component bonded to a pair of lands respectively through solder, the pair of lands being provided on an attaching substrate in a lateral direction with respect to each other. Where plan view distances from ends of the external terminal electrodes at the ridge lines formed between the surfaces and side faces of the element body of the chip component to the edges of the lands connected to the external terminal electrodes are designated as 'd,' and the vertical distances from the bottom surfaces of the external terminal electrodes and the lands are designated as 't,' then d&#x3e;t/tan 35&#xb0; and preferably d&#x3e;t/tan 25&#xb0; is fulfilled.

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Tokyo, Japan

Shota Yajima