Mitsubishi Electric Corporation

Hosokawa Yoko Co., Ltd.

Shota Sato

Kenta Fujii

Yuji Shirakata

Koji Nakajima

Takashi Kumagai

Tsuneo Hamaguchi

Tsutomu Hara

Jun Tahara

Takamasa Mori

Shuji Wakaiki

Tomohiro Tanishita

Kazuaki Fukui

A storage container for storing soft capsules to be orally ingested includes: a storage space for storing the soft capsules; an inner surface facing the storage space and contacting the soft capsules inside the storage space; and a separation unit causing part of a contact region of the soft capsules contacting the inner surface to be separated from the inner surface. The area of the contact portion of the contact region that contacts the inner surface is smaller than the area of the separation portion of the contact region that is separated from the inner surface.

Storage container for soft capsules, soft capsule-containing storage container, and laminate for soft capsules

The present invention relates to a semiconductor device including a printed circuit board, an electronic component, and a heat diffusion part. The printed circuit board includes an insulation layer, first and second conductor layers disposed respectively on first and second main faces of the insulation layer, a plurality of heat radiation vias penetrating from the first conductor layer to the second conductor layer on the insulation layer, and a conductor film covering inner side walls of the heat radiation vias. The heat radiation vias are provided at positions overlapping the electronic component and the heat radiation part in plan view viewed from the first main face of the printed circuit board. The heat diffusion part is disposed overlapping at least some of the heat radiation vias in plan view viewed from the second main face of the printed circuit board.

Semiconductor device

An isolated converter reduced in size compared with a conventional isolated converter and having a high heat dissipation characteristic is provided. The isolated converter includes a multilayer substrate having a first through hole and a magnetic core partially passing through the first through hole. The multilayer substrate includes a first conductor pattern formed at a position overlapping the magnetic core on a second surface when viewed from a direction orthogonal to a first surface, a second conductor pattern formed between the first surface and the second surface at a position overlapping the magnetic core and the first conductor pattern when viewed from the direction orthogonal to the first surface, at least one thermal conductive member formed on the first conductor pattern and having a portion disposed between the multilayer substrate and the magnetic core, and an electric insulating layer electrically insulating the first conductor pattern from the second conductor pattern.

Isolated converter

Provided is a highly reliable power circuit device. The power circuit device includes a printed substrate, a power circuit, and a housing. The power circuit is formed on the printed substrate. The housing is connected with the printed substrate. The power circuit includes secondary-side switching elements, at least one smoothing choke coil, and smoothing capacitors. Portions of a smoothing choke coil core serving as a core of the smoothing choke coil are inserted in opening portions formed in the printed substrate. A winding of the smoothing choke coil is formed on the printed substrate. The smoothing choke coil is located between a region C in which the smoothing capacitors are arranged and regions A and B serving as a second region in which primary-side switching elements and the secondary-side switching elements serving as electric elements are arranged.

Power circuit device

An electromagnetic wave absorption sheet is arranged to contact an upper surface and side surfaces of an electronic component mounted on a wiring board, a heat conduction plate is arranged to contact the electromagnetic wave absorption sheet, a heat transfer sheet is arranged to contact the heat conduction plate, and a heat dissipation member is arranged to contact the heat transfer sheet. Heat conductive particles contained in the heat transfer sheet contact a flat surface portion of the heat conduction plate. The electromagnetic wave absorption sheet, the heat conduction plate, and the heat transfer sheet are interposed between the heat dissipation member and the electronic component, as a heat conduction member for conducting heat generated in the electronic component and the like to the heat dissipation member.

Semiconductor device and method for manufacturing the same and wireless communication apparatus

A printed circuit board includes at least one of a first coil pattern disposed on a first main surface and a second coil pattern disposed on a second main surface. The first coil pattern includes a first portion arranged between a first core portion and a second core portion. The second coil pattern includes a third portion arranged between the first core portion and the second core portion. A first heat transfer member is mounted on at least one of the first portion and the third portion. Therefore, temperature increase of at least one of the first portion and the third portion can be suppressed.

Circuit device and power conversion device

In an electronic circuit board of a power conversion device or the like, heat interference between parts mounted on a multi-layer printed circuit board is suppressed in order to place the mounted parts close to each other. The mounted parts include a semiconductor element and a magnetic part formed by a coil pattern, which is made from a copper foil of the printed circuit board, and by a magnetic core. A screw fixing portions is placed in the surroundings of the semiconductor element and the coil pattern. A heat radiation pattern connected to the screw fixing portion is provided between and around the semiconductor element and the coil pattern when viewed from a direction perpendicular to a principal surface of the multi-layer printed circuit board. The screw fixing portion is connected to a cooler in a manner that gives the screw fixing portion heat conductance and electrical conductance.

Electronic circuit board and power conversion device

A printed board includes an insulating layer, and radiation vias penetrating printed board are formed in both a first region overlapping electronic component and a second region outside the first region. A plurality of conductor layers included in printed board are cross-connected to a plurality of radiation vias. Diffusion radiator includes a thermal diffusion plate, a radiation member, and a cooling body. Radiation member is in close contact with one of main surfaces of cooling body, and thermal diffusion plate is in close contact with one of main surfaces of radiation member on the opposite side to cooling body. One of main surfaces of thermal diffusion plate on the opposite side to radiation member is bonded to a conductor layer on the other main surface of printed board so as to close the plurality of radiation vias.

Growing community of inventors

Tokyo, Japan

Shota Sato