Nippon Soda Co., Ltd.

Shota Osumi

Izumi Tando

Yoshio Hayakawa

Hiroki Ueda

A resin composition for a metal-clad laminate plate includes a block copolymer comprising a butadiene block having a molar ratio of a 1,2-bonding structure to a 1,4-bonding structure of 80:20 to 100:0 and a styrene block. Further, the resin composition for the metal-clad laminate plate includes polybutadiene having a molar ratio of a 1,2-bonding structure to a 1,4-bonding structure of 80:20 to 100:0.

Resin composition for metal-clad laminates, prepreg, and metal-clad laminate

A photosensitive resin composition for flexographic printing includes components (A) to (E) below: (A) a first styrene-butadiene-styrene block copolymer (SBS); (B) a second styrene-butadiene-styrene block copolymer (SBS); (C) a polybutadiene or a derivative thereof; (D) a photopolymerizable monomer; and (E) a photopolymerization initiator, and comprises with respect to (A), 5 to 100 wt % of (B), 10 to 40 wt % of (C), 40 to 200 wt % of (D), and 4 to 20 wt % of (E).

Photosensitive resin composition for flexographic printing

A polyphenylene ether resin composition includes (A) polyphenylene ether, and (B) a block copolymer including a butadiene block having a molar ratio of a 1,2-bonding structure to a 1,4-bonding structure of 80:20 to 100:0 and a styrene block. The number average molecular weight (Mn) of the component (A) may be 1,000 to 7,000, the weight ratio of the styrene block to the butadiene block in the component (B) may be 10:90 to 80:20, and the weight average molecular weight (Mw) of the component (B) may be 2,000 to 100,000.

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Chiba, Japan

Shota Osumi