Hitachi Chemical Company, Ltd.

Resonac Corporation

Shota Okade

Yukiko Muramatsu

Akihiro Nakamura

Yoshikazu Suzuki

Masahiro Miyasaka

Ken Sawabe

Emiko Oota

Hayato Sawamoto

Shuji Nomoto

Sanchoru Ri

Yuji Takase

The present invention relates to provision of a photosensitive resin composition containing (A) a photopolymerizable compound having an ethylenically unsaturated group and an acidic substituent, and (B) a photopolymerization initiator, wherein at least one of the components contained in the photosensitive resin composition is a component including a dicyclopentadiene structure; a photosensitive resin film using the foregoing photosensitive resin composition; a printed wiring board and a method for producing the same; and a semiconductor package.

Photosensitive resin composition, photosensitive resin film, printed wiring board, semiconductor package, and method for producing printed wiring board

A photosensitive resin composition includes (A) a binder polymer having a structural unit derived from a hydroxyalkyl (meth)acrylate ester having a hydroxyalkyl group having from 1 to 12 carbon atoms, and a structural unit derived from a (meth)acrylic acid; (B) a photopolymerizable compound having an ethylenically unsaturated bond group; (C) a photopolymerization initiator; and (D) a styryl pyridine represented by the Formula (1). In Formula (1), each of R, Rand Rindependently represents an alkyl group having from 1 to 20 carbon atoms, an alkoxy group having from 1 to 6 carbon atoms, an alkyl ester group having from 1 to 6 carbon atoms, an amino group, an alkyl amino group having from 1 to 20 carbon atoms, a carboxy group, a ciano group, a nitro group, an acetyl group or a (meth)acryloyl group, each of a, b and c independently represents an integer of from 0 to 5. In a case in which each of a, b and c is independently 2 or more, the plural Rs, Rs, and Rs independently may be the same or different. 

Photosensitive resin composition, photosensitive element, method for producing substrate with resist pattern, and method for producing printed wiring board

A photosensitive resin composition includes a binder polymer, a photopolymerizable compound, and a photopolymerization initiator. The binder polymer has a structural unit derived from a (meth)acrylic acid, a structural unit derived from styrene or &#x3b1;-methylstyrene, and a structural unit derived from a hydroxyalkyl (meth)acrylate ester having a hydroxyalkyl group having from 1 to 12 carbon atoms. The photopolymerizable compound include a bisphenolic di(meth)acrylate having from 1 to 20 structural units of an ethyleneoxy group and having from 0 to 7 structural units of a propyleneoxy group.

Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for producing printed wiring board

Growing community of inventors

Tokyo, Japan

Shota Okade