Mitsubishi Gas Chemical Company, Inc.

Shota Koga

Kentaro Takano

Eisuke Shiga

Katsuya Tomizawa

Meguru Ito

Daisuke Ueyama

Tomoki Hamajima

Yoshihiro Nakazumi

Naoki Kashima

A resin composition according to the present invention contains: (i) a reactant of a cyanate compound (A) and polybutadiene (B) and/or (ii) a reactant of a polymerized product of the cyanate compound (A) and the polybutadiene (B); and a maleimide compound (C).

Resin composition, prepreg, metal foil-clad laminate, resin sheet, and printed wiring board

The resin composition of the present invention contains a maleimide compound (A) represented by the following formula (1); and a cyanate compound (B).  wherein R each independently represents an unsubstituted or substituted monovalent hydrocarbon group having 1 to 12 carbon atoms, a proportion of R representing a methyl group, among all R, is 50 mol % or more, and n represents an integer of 0 to 2.

Resin composition, prepreg, metal-foil-clad laminate, resin sheet, and printed wiring board

Resin composition, prepreg, metal-foil-clad laminate, resin sheet, and printed circuit board

The present invention provides a resin composition containing an allyl group-containing compound (A) and a maleimide compound (B), in which the allyl group-containing compound (A) has a reactive functional group other than an allyl group.

Resin composition, prepreg, metal foil-clad laminate, and printed circuit board

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Tokyo, Japan

Shota Koga