Tokyo Ohka Kogyo Co., Ltd.

Shota Katayama

Kazuaki Ebisawa

Akiya Kawaue

Takahiro Shimizu

Makiko Irie

Yasushi Washio

Yasushi Kuroiwa

Aya Momozawa

A chemically amplified positive-type photosensitive resin composition which is highly sensitive and in which it is easy to form a resist pattern whose cross-sectional shape is rectangular, a photosensitive dry film which includes a photosensitive resin layer formed from the composition, a method of manufacturing the photosensitive dry film, a method of manufacturing a patterned resist film using the composition, a method of manufacturing a substrate with a template using the composition and a method of manufacturing a plated article using the substrate with the template. A Lewis acid compound is included in the composition that also includes an acid generator which generates an acid by application of an active ray or radiation, and a resin whose solubility in alkali is increased by action of an acid.

Chemically amplified positive-type photosensitive resin composition, photosensitive dry film, method of manufacturing photosensitive dry film, method of manufacturing patterned resist film, method of manufacturing substrate with template and method of manufacturing plated article

A chemically amplified positive-type photosensitive resin composition capable of suppressing the occurrence of 'footing' in which the width of the bottom (the side proximal to the surface of a support) becomes narrower than the top (the side proximal to the surface of a resist layer) in the nonresist portion when a resist pattern serving as a template for a plated article is formed on a metal surface of a substrate having a metal surface using the composition. A mercapto compound having the formula (C) shown below is added to the composition and includes an acid generator which generates acid upon exposure to an irradiated active ray or radiation and a resin the solubility of which in alkali increases under the action of acid: wherein n1, n2, R, and Rare defined in claim

Chemical amplification type positive photosensitive resin composition, a photosensitive dry film, a method for producing a photosensitive dry film, a method for producing a patterned resist film, a method of manufacturing a template with a substrate, and a method of manufacturing a plated shaped product, and a Mercapto compound

A chemically amplified positive-type photosensitive resin composition containing a predetermined amount of organic solvent (S1) having a boiling point of 120 to 180&#xb0; C., and satisfying the following requirements:

Chemically amplified positive-type photosensitive resin composition, method of manufacturing substrate with template, and method of manufacturing plated article

A photosensitive resin composition, a method of manufacturing a substrate with a template using the composition, and a method of manufacturing a plated article using the substrate with a template. The photosensitive resin composition may be used to form a plated article on a metal surface of a substrate The composition includes an acid generator that, when irradiated with an active ray or radiation, generates an acid, a resin that, under an action of an acid, undergoes an increase in solubility thereof in alkali, and a fluorene compound represented by the formula (1). 

Chemically amplified positive-type photosensitive resin composition

A chemically amplified positive-type photosensitive resin composition capable of suppressing the phenomenon of footing in which the width of the bottom (the side proximal to the surface of a support) becomes narrower than that of the top (the side proximal to the surface of a resist layer) when a resist pattern serving as a template for a plated article is formed on a metal surface of a substrate using the composition. A mercapto compound is contained in the composition which includes an acid generator capable of producing an acid when irradiated with an active ray or radiation and a resin whose solubility in alkali increases under the action of acid.

A chemically amplified photosensitive resin composition including a compound represented by formula (1) and/or formula (4), a resin having an acid-dissociative dissolution-controlling group whose solubility in alkali increases under the action of an acid or an alkali-soluble resin, a photoacid generator, and an organic solvent, in which the solid concentration is 40% by mass to 65% by mass. R, R, and Rindependently represent a hydrogen atom or an alkyl group, Rrepresents a group represented by formula (2) or (3), and Rand Rrepresent a monovalent hydrocarbon group which may have a substituent. 

Growing community of inventors

Kawasaki, Japan

Shota Katayama