Shin-etsu Chemical Co., Ltd.

Shota Akiba

Kenichi Tsuji

Kunihiro Yamada

Mitsuhiro Iwata

Provided are a thermal conductive silicone composition having a favorable heat dissipation property; and a semiconductor device using such composition. The thermal conductive silicone composition contains:

Thermal conductive silicone composition and semiconductor device

A thermal conductive silicone composition contains, in specific amounts, each of (A) an organopolysiloxane containing two or more alkenyl groups bonded to a silicon atom in one molecule, (B) an organohydrogenpolysiloxane containing two or more hydrogen atoms bonded to a silicon atom in one molecule, (C) a catalyst for hydrosilylation reaction, (D) a silver powder with a tapped density of 3.0 g/cmor higher, a specific surface area of 2.0 m/g or less, and an aspect ratio of 1 to 30, and (E) a natural graphite powder or a synthetic graphite powder with an average particle size of 3 μm to 50 μm. This provides: a thermal conductive silicone composition that gives a cured material having a favorable heat-dissipating property; a semiconductor device using the cured material of the composition; and a method for manufacturing the same.

Thermal conductive silicone composition, semiconductor device, and method for manufacturing the same

Provided is a thermal conductive silicone composition containing:

Thermal conductive silicone composition, semiconductor device, and method for manufacturing semiconductor device

With respect to an addition-curable thermally conductive silicone composition in which a silver filler is blended, a catalyst having a specific structure and an organohydrogen polysiloxane having a specific structure are used for the purpose of extending the working life at room temperature, while maintaining the flexibility, so that a thermally conductive silicone composition which is able to have a good balance between flexibility after curing and storage stability in one pack, while having extremely low thermal resistance and excellent reliability is achieved.

Thermally conductive silicone composition

Provided is a thermal conductive silicone composition having a superior thermal conductivity. The thermal conductive silicone composition contains:

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Shota Akiba