Ngk Insulators, Inc.

Techno Coat Company, Ltd.

Shoju Aoshima

Naokuni Muramatsu

A method for treating a Cu thin sheet is provided. The method comprises the steps of: supplying a slurry in which a diffusion bonding aid (DBA), such as Ni powder, and a reinforcing material (RM), such as a carbide base metal compound, are dispersed in a solvent to a predetermined portion on a Cu or Cu base alloy thin sheet, drying the supplied slurry, and applying a laser to induce melting, solidification, and fixation, so as to form a buildup layer. In the method, the weight ratio of DBA to RM is specified to be 80:20 to 50:50, and the median diameters Dof both DBA and RM employed fall within 0.1 to 100 &#x3bc;m, the median diameter Dof DBA is larger than the median diameter Dof RM, and both the distribution ratio D/Dof DBA and the distribution ratio D/Dof RM are 4.0 or less.

Method for treating Cu thin sheet

A mold for casting aluminum or aluminum alloy made of a copper alloy having a thermal conductivity of not less than 0.20 cal/s.cndot.cm.degree.C. The mold cavity surface is locally or entirely formed with a coated layer. The coated layer may be either (i) a cermet layer including of at least one element selected from the group consisting of Co, Cu, Cr and Ni, or (ii) a Co--, Ni--, Cr --or Mo-based hard alloy layer. The copper alloy mold exhibits distinguished thermal conductivity and resistance to melt damages.

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Fujieda, Japan

Shoju Aoshima