Mitsubishi Denki Kabushiki Kaisha

Shojiro Kodai

Katsunori Ochi

Fumiaki Baba

Osamu Murakami

A method for manufacturing an integrated circuit card by providing a circuit board having electronic components mounted thereon intermediate the thickness of a molded frame and filling the frame with resin in a mold so that the resin passes through an opening in the circuit board and seals both sides of the board to a thickness no greater than the frame thickness.

Method for manufacturing an encapsulated IC card having a molded frame

An IC card including a circuit, electronic parts, and an I/O portion mounted on a circuit board integrally formed on a frame at its periphery. The circuit board, the circuit, and the electronic parts are hermetically sealed, except for a portion of the I/O portion, and the frame is filled with synthetic resin to a thickness no greater than that of the frame.

IC card and manufacturing method therefor

An IC card includes a thin plate forming an external surface of the card, a circuit board formed on an internal surface of the thin plate, and a frame surrounding peripheries of the thin plate and the circuit board. A space defined by the frame and the surface plate is filled with molded resin. A portion of an inner peripheral surface of the frame projects into the resin. The molded resin completely covers a surface of the circuit board and integrates the frame and the thin plate.

Growing community of inventors

Itami, Japan

Shojiro Kodai