Rohm Co., Ltd.

Shoji Yasunaga

Motoharu Haga

Yasumasa Kasuya

Akihiro Koga

Mamoru Yamagami

A semiconductor device includes two or more semiconductor elements, a lead with island portions on which the semiconductor elements are mounted, a heat dissipation member for dissipating heat from the island portions, a bonding layer bonding the island portions and the heat dissipation member, and a sealing resin covering the semiconductor elements, the island portions and a part of the heat dissipation member. The bonding layer includes mutually spaced individual regions provided for the island portions, respectively.

Semiconductor device

[Object] A semiconductor device is configured to release heat from semiconductor chips more efficiently. [Means for Solution] A semiconductor device includes: a die padwhich has a die pad main surfaceand a die pad rear surface; a semiconductor chipmounted on the die pad main surface; a sealing resin portionformed with a recessfor exposure of the die pad rear surfaceand covering the die padand the semiconductor chip; and a heat releasing layerdisposed in the recess. The recesshas a recess grooveoutside the die padin a direction in which the die pad rear surfaceextends, and the recess grooveis closer to the die pad main surfacethan to the die pad rear surface. The heat releasing layerhas a junction layer which is in contact with the die pad rear surfaceand having part thereof filling the recess groove

A resin-encapsulated semiconductor device having a semiconductor chip which is prevented from being damaged. The resin-encapsulated semiconductor device () comprises a semiconductor chip () including a silicon substrate, a die pad () to which the semiconductor chip () is secured through a first solder layer (), a resin-encapsulating layer () encapsulating the semiconductor chip (), and lead terminals () electrically connected to the semiconductor chip () and including inner lead portion () covered with the resin-encapsulating layer (). The lead terminals () are made of copper or a copper alloy. The die pad () is made of 42 alloy or a cover alloy and has a thickness (about 0.125 mm) less than the thickness (about 0.15 mm) of the lead terminals ().

Resin-encapsulated semiconductor device and its manufacturing method

A semiconductor device includes a semiconductor chip, a lead arranged on a side portion of the semiconductor chip, and a wire, whose one end and another end are bonded to the semiconductor chip and the lead respectively, having a ball portion and a stitch portion wedged in side elevational view on the semiconductor chip and the lead respectively. An angle of approach of the wire to the lead is not less than 50&#xb0;, and the length of the stitch portion is not less than 33 &#x3bc;m.

Semiconductor device and production method therefor

[Object] A semiconductor device is configured to release heat from semiconductor chips more efficiently. [Means for Solution]A semiconductor device includes: a die padwhich has a die pad main surfaceand a die pad rear surface; a semiconductor chipmounted on the die pad main surface; a sealing resin portionformed with a recessfor exposure of the die pad rear surfaceand covering the die padand the semiconductor chip; and a heat releasing layerdisposed in the recess. The recesshas a recess grooveoutside the die padin a direction in which the die pad rear surfaceextends, and the recess grooveis closer to the die pad main surfacethan to the die pad rear surface. The heat releasing layerhas a junction layer which is in contact with the die pad rear surfaceand having part thereof filling the recess groove

There is provided a resin-sealed semiconductor device (BGA type semiconductor device) whose heat dissipating characteristic is improved, so that it is prevented from deteriorating in reliability. This BGA type semiconductor device includes a wiring substrate on a predetermined area on which a semiconductor chip is mounted; a plurality of metal bumps that are formed to be arranged at predetermined intervals in an area of the substrate different from the area on which the semiconductor chip is mounted; and a sealing resin layer that covers at least the semiconductor chip. Each of the plurality of metal bumps is covered with the sealing resin layer described above, with a part thereof exposed at a top face of the sealing resin layer.

Growing community of inventors

Kyoto, Japan

Shoji Yasunaga