Genusion, Inc.

Shoji Shukuri

Natsuo Ajika

Masaaki Mihara

Satoshi Shimizu

Taku Ogura

Moriyoshi Nakashima

Yoshiki Kawajiri

According to an aspect of the present invention, it is provided: a nonvolatile semiconductor memory device comprising: a plurality of bit lines arranged in a first direction; a plurality of source lines arranged in the first direction, the plurality of source lines being parallel to the plurality of bit lines, the plurality of source lines being distinct from the plurality of bit lines; a plurality of memory gate lines arranged in a second direction perpendicular to the first direction; a plurality of memory cells arranged in a matrix, each of the plurality of memory cells including a p type MIS nonvolatile transistor having a first terminal, a second terminal, a channel between the first terminal and the second terminal, a gate insulation film formed on the channel, a gate electrode connected to one corresponding memory gate line of the plurality of memory gate lines, and a carrier storage layer formed between the gate insulation film and the gate electrode, the first terminal being connected to one corresponding bit line of the plurality of bit lines and the second terminal being connected to one corresponding source line of the plurality of source lines.

Nonvolatile semiconductor memory device

A hot electron (BBHE) is generated close to a drain by tunneling between bands, and it data writing is performed by injecting the hot electron into a charge storage layer. When Vg is a gate voltage, Vsub is a cell well voltage, Vs is a source voltage and Vd is a drain voltage, a relation of Vg&#x3e;Vsub&#x3e;Vs&#x3e;Vd is satisfied, Vg&#x2212;Vd is a value of a potential difference required for generating a tunnel current between the bands or higher, and Vsub&#x2212;Vd is substantially equivalent to a barrier potential of the tunnel insulating film or higher.

Nonvolatile semiconductor memory

A non-volatile semiconductor device includes an n type well formed in a semiconductor substrate having a surface, the surface having a plurality of stripe shaped grooves and a plurality of stripe shaped ribs, a plurality of stripe shaped p type diffusion regions formed in upper parts of each of the plurality of ribs, the plurality of stripe shaped p type diffusion regions being parallel to a longitudinal direction of the ribs, a tunneling insulation film formed on the grooves and the ribs, a charge storage layer formed on the tunneling insulating film, a gate insulation film formed on the charge storage layer, and a plurality of stripe shaped conductors formed on the gate insulating film, the plurality of stripe shaped conductors arranged in a direction intersecting the longitudinal direction of the ribs with a predetermined interval wherein an impurity diffusion structure in the ribs are asymmetric.

Non-volatile semiconductor memory device and manufacturing method thereof

Non-volatile semiconductor memory device

A nonvolatile semiconductor memory device includes a first PMOS transistor and a second PMOS transistor having a gate, the first and the second PMOS transistors being connected in series; and a first NMOS transistor and a second NMOS transistor having a gate, the first and the second NMOS transistors being connected in series; wherein the gate of the second PMOS transistor and the gate of the second NMOS transistor are commonly connected and floated.

Nonvolatile semiconductor memory device and usage method thereof

The present invention relates to a nonvolatile semiconductor memory, and more specifically relates to a nonvolatile semiconductor memory with increased program throughput. The present invention provides a nonvolatile semiconductor memory device with a plurality of block source lines corresponding to the memory blocks, arranged in parallel to the word lines, a plurality of global source lines arranged in perpendicular to the block source lines; and a plurality of switches for selectively connecting corresponding ones of the block source lines and the global source lines.

A hot electron (BBHE) is generated close to a drain by tunneling between bands, and bit data writing is performed by injecting the hot electron into a charge storage layer. When Vg is a gate voltage, Vsub is a cell well voltage, Vs is a source voltage and Vd is a drain voltage, a relation of Vg&#x3e;Vsub&#x3e;Vs&#x3e;Vd is satisfied, Vg&#x2212;Vd is a value of a potential difference required for generating a tunnel current between the bands or higher, and Vsub&#x2212;Vd is substantially equivalent to a barrier potential of the tunnel insulating film or higher.

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Hyogo, Japan

Shoji Shukuri