Unitika Ltd.

Shoji Okamoto

Kenjin Shiba

Yoshiaki Echigo

Hayami Onishi

Isao Tomioka

Hiroshi Yamada

Yoshiaki Iwaya

Hiroshi Kajimaru

Masafumi Yamada

Arihiro Anada

Minoru Saitou

Keitarou Seto

An aqueous polyolefin resin dispersion, a process for producing the same, and a water-based coating material comprising the same are provided. The aqueous polyolefin resin dispersion contains a polyolefin resin containing 50 to 98% by mass of an unsaturated hydrocarbon having 3 to 6 carbon atoms and 0.5 to 20% by mass of an unsaturated carboxylic acid unit, and a basic compound, and contains substantially no water-compatibilizing agent having a boiling point of 185&#xb0; C. or higher at normal pressure. The polyolefin resin has a number average particle size of 1 &#x3bc;m or smaller in the aqueous dispersion.

Aqueous polyolefin resin dispersion, process for producing the same, and water-based coating material comprising the same

Using a gas barrier resin composition including 83 to 15% by mass of a compound (A) having two or more hydroxyl groups in a molecule thereof and 17 to 85% by mass of a compound (B) in which at least one carboxyl group is bound to each of three or more consecutive carbon atoms in a molecule thereof, wherein the compound (B) is any one of a compound in which no anhydrous structure is made among the carboxyl groups and a compound in which at least one anhydrous structure is made among the carboxyl groups, or using a gas barrier coating agent including the compound (A), the compound (B) and a solvent, the present invention provides a gas barrier molded material, which has high gas barrier property in that it has less reduction of gas barrier property even in a high humidity atmosphere, has excellent transparency, does not generate poisonous gas when it is subjected to an incineration treatment, is friendly to the natural environment because of the non-use of organic solvents, and has good productivity.

Gas barrier resin composition, gas barrier coating material, and gas-barrier molding

An aqueous dispersion that comprises: (A) a polyolefin terpolymer resin obtained from (a) an unsaturated carboxylic acid or anhydride thereof, (b) an ethylenic hycrocarbon, and (c) a specific compound, the proportion of (a) being 0.01 to 5 wt %, excluding 5 wt %, and the ratio of (b) to (c) being from 55/45 to 99/1 (wt %); (B) a basic compound; and (C) an aqueous medium, that the polyolefin terpolymer resin (A) dispersed in the aqueous medium has a number-average particle diameter of 1 &mgr;m or smaller, and that the dispersion contains substantially no nonvolatile water-compatibilizing agent. Also provided are a coated film obtained by applying this aqueous dispersion to a thermoplastic resin and a coated metal material obtained by applying this aqueous dispersion to a metal material.

Aqueous polyolefin resin dispersion

This invention provides a polyimide precursor solution having high concentration and low viscosity and a production process thereof, and polyimide coatings and films having excellent physical properties obtained therefrom and a production process thereof. Particularly, it relates to a polyimide precursor solution which contains a salt of a specific diamine with a specific tetracarboxylic acid, as its solute; to a process for the production of the polyimide precursor solution, which comprises allowing 1 mole of a specified diamine to react with 0.3 to 0.9 mole of a specific tetracarboxylic acid dianhydride, thereby obtaining a diamine, and subsequently adding 0.95 to 1.05 moles of a specified tetracarboxylic acid to 1 mole of the thus obtained diamine; to a polyimide coating or film obtained from the aforementioned polyimide precursor solution; and to a process for the production of the polyimide coating or film, which comprises coating the aforementioned polyimide precursor solution on a substrate and heating the coat to effect imidization.

Polyimide precursor solution process for the production thereof coating

This invention provides a poly(amic acid) solution which does not contain aprotic polar solvents such as DMF, NMP, DMAc, DMSO, as well as a polyimide film obtained therefrom having appropriate flexibility and a small coefficient of linear thermal expansion and a coated material in which the polyimide film is formed on a substrate. More particularly, it provides a poly(amic acid) solution which has an aromatic poly(amic acid) and a tertiary amine as the solute and a water soluble alcohol compound and/or a water soluble ether compound as the solvent and contains substantially no aprotic polar solvent, as well as a polyimide film obtained from the poly(amic acid) solution and a coated material obtained by forming the film on a substrate.

Growing community of inventors

Kyoto, Japan

Shoji Okamoto