The Japan Steel Works, Ltd.

University of Yamanashi

Waseda University

Piezo Studio Inc.

Sanan Japan Technology Corporation

Shoji Kakio

Kazuhito Kishida

Jun Mizuno

Rinzo Kayano

Kouhei Kurimoto

Hiroaki Yokota

Kengo Ogawa

Kazuhiro Watanabe

Satoru Ohsaki

Noriyuki Watanabe

Noritoshi Kimura

Toshifumi Yonai

A surface acoustic wave device includes a piezoelectric substrate formed from a CaTa(GaAl)SiOsingle crystal, and an interdigital electrode formed on the surface of the piezoelectric substrate and formed from Al. The interdigital electrode is configured to generate a Love-wave-type SH wave on the surface of the piezoelectric substrate. A normalized film thickness obtained by dividing the film thickness of the interdigital electrode by the wavelength of the Love-wave-type SH wave is 0.16 or less.

Surface acoustic wave device

An elastic wave device that excites main vibration of an SH mode includes a piezoelectric layer formed from a piezoelectric material, a carrier substrate, and an IDT electrode formed on the piezoelectric layer. When a wavelength of an elastic wave, which is determined by an electrode cycle P of the IDT electrode, is represented by λ, the piezoelectric layer has a thickness of 0.15λ or more and 1.5λ or less. The carrier substrate has an acoustic anisotropy, and is arranged in a crystal orientation that reduces unnecessary vibrations of an SV mode and a vertical L-mode.

Elastic wave device, elastic waves filter, duplexer, and module

A bonded substrate includes a quartz substrate and a piezoelectric substrate which is bonded on the quartz substrate and on which a surface acoustic wave propagates, wherein the quartz substrate and the piezoelectric substrate are bonded by covalently coupling at a bonding interface, and an orientation of the quartz substrate and an orientation of the piezoelectric substrate intersect with each other on an orthogonal direction side or in the range of 65 degrees to 115 degrees in a bonding surface direction.

Bonded substrate, surface acoustic wave element, surface acoustic wave element device, and bonded substrate manufacturing method

In a surface acoustic wave resonator according to an embodiment, a quartz-crystal substrate includes an AT-cut 0&#xb0; X-propagation first quartz-crystal substrate and a Z-cut second quartz-crystal substrate bonded over the first quartz-crystal substrate. A propagation direction of a surface acoustic wave in the second quartz-crystal substrate is inclined from an X-axis of a crystal by 27 to 33&#xb0;, 87 to 93&#xb0;, or 147 to 153&#xb0;, and a thickness of the second quartz-crystal substrate is 0.2 to 1.0 times a wavelength of the surface acoustic wave.

Surface acoustic wave resonator, its manufacturing method, and radio circuit

A method of manufacturing a bonded substrate, which has a quartz substrate and a piezoelectric substrate bonded, includes irradiating a bonding surface of the quartz substrate and a bonding surface of the piezoelectric substrate with ultraviolet light under a pressure lower than atmosphere pressure. After the irradiation, the bonding surface of the quartz substrate and the bonding surface of the piezoelectric substrate are brought into contact. And the quartz substrate and the piezoelectric substrate are pressurized in a thickness direction to bond the bonding surfaces.

Method of manufacturing bonded substrate

In a surface acoustic wave filter according to an embodiment, a thickness of a piezoelectric crystal substrate bonded over a support substrate made of an oxide crystal is 0.05 to 0.5 &#x3bc;m, and an odd-order harmonic is used.

Surface acoustic wave filter and manufacturing method therefor

An optical modulator, a substrate for an optical modulator, a method of manufacturing an optical modulator, and a method of manufacturing a substrate for an optical modulator that can reduce a propagation loss are provided. An optical modulatoraccording to an embodiment includes: a base substrate; a waveguide substratedisposed over the base substrateand including an electro-optic effect; a waveguideformed on the waveguide substratefor performing optical modulation; and an electrodeconfigured to apply a voltage to the waveguide. Here, the base substrateand the waveguide substrateare made of the same material, the waveguideis formed inside the waveguide substrate, and a refractive index of the waveguide substrateis larger than a refractive index of the base substrate

Optical modulator, substrate for optical modulator, method of manufacturing optical modulator, and method of manufacturing substrate for optical modulator

There is provided a bonded substrate including: a quartz substrate; and a piezoelectric substrate which is bonded on the quartz substrate and on which a surface acoustic wave propagates, wherein the quartz substrate and the piezoelectric substrate are bonded at a bonding interface through covalent bonding, and a surface acoustic wave element having a higher phase velocity and a higher electromechanical coupling factor than conventional one is obtained by disposing an interdigital electrode on a principal surface of the piezoelectric substrate.

Growing community of inventors

Yamanashi, Japan

Shoji Kakio