Panasonic Corporation

Panasonic Intellectual Property Management Co., Ltd.

Matsushita Electric Industrial Co., Ltd.

Shoji Hoshitoku

Yasuharu Kinoshita

Toshiki Matsukawa

Takeshi Iseki

Seiji Tsuda

Mituru Harada

Masaharu Takahashi

Naohiro Takashima

Yoshinori Ando

Hironori Tsubota

Yasuhiro Kashima

Takasi Oobayasi

Naoki Shibuya

Kazutosi Matumura

A chip resistor includes a resistive element, first and second electrodes disposed on a lower surface the resistive element, a protective film disposed on the lower surface of the resistive element and between the first and second electrodes. The resistive element has first and second recesses therein. The first recess extends from the lower surface along a first edge surface and does not reach an upper surface of the resistive element. The second recess extends from the lower surface along a second edge surface and does not reach the upper surface of the resistive element. The first and second electrodes are disposed between the first and second recesses. The protective film is disposed between the first and second electrodes. A first plating layer disposed on the first electrode and an inner surface of the first recess. A second plating layer is disposed on the second electrode and an inner surface of the second recess. This chip resistor avoids mounting failures.

Chip resistor and method for manufacturing the same

In a method of manufacturing a resistor, a sheet-shaped resistive element having formed thereon a plurality of belt-shaped electrodes is cut in a direction crossing these belt-shaped electrodes to produce strip-shaped resistive elements. On the other hand, a metal paste containing a glass frit is printed in a pattern of belts arranged at regular intervals on a surface of a plate-shaped insulating substrate to form a plurality of adhesive layers. Then, the strip-shaped resistive elements are respectively applied to the adhesive layers on the plate-shaped insulating substrate, and these are fired in a nitrogen atmosphere. After firing, while a resistance value of a part between each adjacent two electrodes of each strip-shaped resistive element is measured, the strip-shaped resistive element is trimmed so that the resistance value becomes a predetermined value. Then, the plate-shaped insulating substrate having adhered thereto the strip-shaped resistive elements is divided into pieces.

Resistor and manufacturing method for same

A chip-shaped electronic component includes a substrate and an end face electrode layer provided on an end face of the substrate, in which the end face electrode layer contains a mixed material. The mixed material includes as a conductive particle, a carbon powder, a whisker-like inorganic filler coated with a conductive film, and a flake-like conductive powder. Additionally, an epoxy resin has a weight-average molecular weight between 1,000 and 80,000.

Chip-shaped electronic component

A chip-shaped electronic part includes: a substrate; a pair of upper surface electrodes formed on an upper surface of the substrate; a functional element formed to be electrically connected to the upper surface electrode pair; a pair of lower surface electrodes formed on a lower surface of the substrate at positions opposing the upper surface electrode pair; a pair of end surface electrodes formed on end surfaces of the substrate so that each of the end surface electrode pair is electrically connected to one of the upper surface electrode pair, and to one of the lower surface electrode pair corresponding to the one upper surface electrode; a protective film formed in such a manner as to cover at least the functional element; and a plated layer formed in such a manner as to cover at least each of the upper surface electrode pair, wherein the protective film or the plated layer has at least two points of application at which a load from above the substrate is exerted.

Chip-shaped electronic part

A multiple chip resistor is manufactured in the following method. First electrode layers are formed on a first surface of a substrate. Resistor elements electrically connected to the first electrode layers, respectively, are formed on the first surface of the substrate. Slits are formed in the substrate for separating the first electrode layers. Edge electrodes connected to the first electrode layers at the edges of the slits, respectively, are formed on respective edges at the slits of the substrate. The substrate is divided at the slits into strip substrates. Portions of the edge electrodes are removed for electrically isolating the resistor elements from each other. The method provides the edge electrodes on each strip substrate with an improved dimensional accuracy, hence allowing the edge electrodes to be isolated electrically from each other. Consequently, the multiple chip resistor is prevented from being mounted defectively when the resistor is surface-mounted.

Method for manufacturing chip resistor

Growing community of inventors

Fukui, Japan

Shoji Hoshitoku