Sumitomo Electric Industries, Limited

Sumitomo Electric Printed Circuits, Inc.

Mec Company Ltd.

Nippon Soda Co., Ltd.

Tokyo Denki University

Kyoto University

Shoichiro Sakai

Koji Nitta

Atsushi Fukunaga

Shinji Inazawa

Kenji Takahashi

Kousuke Miura

Eiko Imazaki

Masatoshi Majima

Junichi Motomura

Maki Ikebe

Koma Numata

Junichi Okaue

Yoshio Oka

Akira Tsuchiko

Kazuki Okuno

Yasushi Mochida

Tadahiro Kaibuki

Toshiyuki Nohira

Rika Hagiwara

Ryuta Ohsuka

Masahiro Itoh

Akihisa Hosoe

Hiroshi Ueda

Tomoyuki Awazu

Chihiro Hiraiwa

Hirohisa Saito

Kou Noguchi

Mitsutaka Tsubokura

Kohei Okamoto

Masahiro Matsumoto

Yu Fukui

Kenji Nishie

Mari Sogabe

Eiko Itani

Masashi Iwamoto

Yoshihito Yamaguchi

Masaharu Yasuda

Koji Kasuya

Atsushi Yamaguchi

Nobuyuki Mori

Nozomu Kawabe

Keiichiro Tanabe

Nobuhiro Ota

Hajime Ota

Kengo Goto

Nobuyuki Okuda

Yukihiro Oishi

Toshiaki Yamashita

Masatada Numano

Koutarou Kimura

Masanao Yamashita

Masahiro Kato

Ryuichi Inoue

Naoaki Yabuuchi

Hideaki Ito

Hitoshi Kobayashi

Kouji Nitta

Kazuhiko Matsumoto

Shinichi Maruyama

Masahiro Itou

Shingo Nagata

Tatsuya Ishibashi

A printed wiring board includes: a base film having a main surface; a wiring disposed on the main surface; a first plating lead connected to a first position of the wiring; and a second plating lead connected to a second position of the wiring. A cross sectional area of the wiring at a third position of the wiring is 95% or more of a cross sectional area of the wiring at the first position, the third position being an intermediate position between the first position and the second position.

Printed wiring board

A wet treatment apparatus is configured to treat a continuously moving sheet-shaped workpiece and includes a wet treatment tank including a side surface portion having a first slit, a pair of rolls located outside the wet treatment tank, the pair of rolls being spaced apart from the first slit and being arranged in such a manner as to nip the workpiece in a transverse direction, and a pair of treatment-liquid shield members disposed on a side opposite to a side on which the wet treatment tank is disposed with the pair of rolls interposed between the pair of treatment-liquid shield members and the wet treatment tank in a movement direction of the workpiece. In a direction parallel to a width of the first slit, a width of the shield member is larger than a width of the roll.

Wet treatment apparatus and method of manufacturing flexible printed circuit board

A printed wiring board includes: a base film having a main surface; a wiring disposed on the main surface; and at least one plating lead disposed on the main surface and connected to the wiring.

A regenerating method of a removal liquid including: removing a nickel-chromium-containing layer from a substrate using the removal liquid at a time of manufacturing a printed circuit board by a semi-additive method, the substrate including the nickel-chromium-containing layer and a copper-containing layer; collecting the removal liquid that has been used; and contacting the collected removal liquid in collecting the removal liquid with a chelate resin, wherein the chelate resin includes a functional group represented by a following formula (1): where a plurality of Rs are identical divalent hydrocarbon groups having 1 to 5 carbons, and a portion of hydrogen atoms in the hydrocarbon groups are substituted with halogen atoms or not substituted with a halogen atom.

Regenerating method of removal liquid and regenerated removal liquid preliminary

A flexible printed wiring board according to an aspect of the present disclosure is a flexible printed wiring board including a base film and a plurality of wiring lines disposed on a front surface of the base film. Each of the wiring lines has a front end surface extending in a longitudinal direction of the wiring line and two side surfaces extending in the longitudinal direction, and the side surfaces have an arithmetical mean roughness Ra of 0.05 μm to 2.0 μm. The wiring lines have an average height of 40 μm to 120 μm. The wiring lines have an average spacing of 1 μm to 30 μm.

Flexible printed wiring board and method of manufacturing the same

A flexible printed circuit board includes a base film having an insulating property and a plurality of interconnects laminated to at least one surface side of the base film. The plurality of interconnects includes a first interconnect and a second interconnect in a same plane. An average thickness of the second interconnect being greater than an average thickness of the first interconnect. A ratio of the average thickness of the second interconnect to the average thickness of the first interconnect is greater than or equal to 1.5 and less than or equal to 50. The first interconnect includes a first conductive underlayer and a first plating layer, and the second interconnect includes a second conductive underlayer, a second plating layer, and a third plating layer.

Flexible printed circuit board and method of manufacturing flexible printed circuit board

A printed wiring board includes a base layer having insulating properties, a first conductive layer directly or indirectly stacked on the base layer front surface, and including a copper foil, a second conductive layer directly or indirectly stacked on the base layer back surface, and including a copper foil, a stacked body for a via hole, the stacked body being stacked on an inner periphery and a bottom of a connection hole that extends through the first conductive layer and the base layer in a thickness direction, and being configured to electrically connect the first conductive layer and the second conductive layer to each other, and having an electroless copper plating layer. Each copper foil contains a copper crystal grain oriented in a plane orientation, and an average crystal grain size of copper of each copper foil is 10 μm or greater, the electroless copper plating layer includes palladium.

In manufacturing a printed circuit board using a semi-additive method, a removal liquid that has been used in removing a nickel-chromium-containing layer () is regenerated by contacting the removal liquid with a chelate resin having a functional group represented by a following formula (1): where a plurality of Rs are identical divalent hydrocarbon groups having 1 to 5 carbons, and a portion of hydrogen atoms may be substituted with halogen atoms.

Method of manufacturing printed circuit board

A printed wiring board includes an electrically insulating base film, and an electrically conductive pattern stacked on at least one surface side of the base film. An average width of multiple wiring portions included in the electrically conductive pattern is 5 μm or greater and 20 μm or less. Each of the wiring portions includes a seed layer and a plating layer. The plating layer includes copper crystal planes of a (111) plane, a (200) plane, a (220) plane, and a (311) plane. An intensity ratio IRof an X-ray diffraction intensity of the copper crystal plane (220) obtained by Equation (1) below is 0.05 or greater and 0.14 or less,/()  (1)(where I, I, I, Iare respectively X-ray diffraction intensity of the (111) plane (200) plane, the (220) plane, and the (311) plane).

Printed wiring board and method of manufacturing the same

A flexible printed circuit board includes: a base film having a hole for forming a through hole; and a coil-shaped wiring layer layered on at least one surface side of the base film, wherein the wiring layer includes a land portion arranged at an inner peripheral surface of the hole and at a peripheral portion of the hole of the base film, and a winding portion arranged in a spiral shape with the land portion as an inside end portion or an outside end portion, wherein the winding portion includes a first winding portion that is an outermost circumference and a second winding portion that is inside relative to the outermost circumference, and wherein a ratio of an average thickness of the land portion to an average thickness of the second winding portion is 1.1 or more and 5 or less.

Flexible printed circuit board and method of manufacturing same

A flexible printed circuit board includes a base film having an insulating property, and one or more interconnects laminated to at least one surface side of the base film. At least one of the one or more interconnects includes, in a longitudinal direction, a first portion and a second portion that is a portion other than the first portion, an average thickness of the second portion being greater than an average thickness of the first portion. A ratio of the average thickness of the second portion to the average thickness of the first portion is greater than or equal to 1.5 and less than or equal to 50.

The printed circuit board includes, a first conductive layer including copper foil, an insulating base layer, and a second conductive layer including copper foil in this order, and includes a via-hole laminate that is stacked on an inner circumference and a bottom of a connection hole extending through the first conductive layer and the base layer in a thickness direction. The via-hole laminate has an electroless copper plating layer stacked on the connection hole and an electrolytic copper plating layer stacked on the electroless copper plating layer. The copper foil has copper crystal grains oriented in a (100) plane orientation, and an average crystal grain size of copper of 10 μm or more. The electroless copper plating layer includes palladium and tin, and an amount of the palladium stacked per unit area of a surface of the copper foil is 0.18 μg/cmor more and 0.40 μg/cmor less.

Printed circuit board

A flexible printed circuit board according to an aspect is a flexible printed circuit board including a base film and a wiring layer disposed on at least one surface of the base film and having a plurality of wiring lines. The wiring lines have an average line width of 30 μm or less and an average spacing of 30 μm or less. The wiring lines have a copper-based plating layer. The copper-based plating layer has an electrical resistivity of more than 1.68×10Ω·m.

Flexible printed circuit board and method for producing the same

A flexible printed circuit board includes a base film having an insulating property, and multiple interconnects laminated to at least one surface side of the base film. The multiple interconnects include a first interconnect and a second interconnect in a same plane. An average thickness of the second interconnect is greater than an average thickness of the first interconnect. A ratio of the average thickness of the second interconnect to the average thickness of the first interconnect is greater than or equal to 1.5 and less than or equal to 50.

A printed wiring board production method that forms a base film and a conductive pattern on the base film by an additive method or a subtractive method, includes a plating process that electroplates the conductive pattern on a surface of the base film, wherein the plating process includes a shield plate arranging process that arranges a shield plate between an anode and a printed wiring board substrate that forms a cathode, and a substrate arranging process that arranges the printed wiring board substrate in a plating tank, and wherein a distance between the shield plate and the printed wiring board substrate is 50 mm or greater and 150 mm or less.

Printed wiring board production method and printed wiring board production apparatus

Growing community of inventors

Osaka, Japan

Shoichiro Sakai