Nichia Corporation

Shoichi Yamada

Masatsugu Ichikawa

Takeshi Kihara

Masahiko Sano

Yutaka Matsusaka

Hiroto Tamaki

Shoji Hosokawa

Daisuke Iwakura

Takafumi Sugiyama

Masatoshi Kameshima

Takayoshi Wakaki

Toru Takasone

Hiroyuki Inoue

A method of producing a composite material, the method including: preparing a mixed powder of diamond particles and copper powder particles; and generating a composite material containing diamond and copper from the mixed powder by pulsed electric current sintering with a pressure of 5 MPa or greater and 100 MPa or less applied to the mixed powder, and the mixed powder maintained at a temperature equal to or higher than 500° C. and lower than 800° C.

Method of producing composite material

A method of producing a composite substrate includes: providing a layered body including: a base layer formed of a composite material containing diamond and a metal, the base layer having a first surface, and a second surface opposite to the first surface, and a flat layer having a lower surface bonded to the first surface of the base layer, and an upper surface having a surface roughness Ra of 10 nm or less; and directly bonding an insulating layer to the upper surface of the flat layer.

Composite substrate and method of producing the composite substrate, and semiconductor device comprising the composite substrate

A composite substrate includes a base layer formed of a composite material containing diamond and a metal, the base layer a first surface, and a second surface opposite to the first surface; a flat layer having a lower surface bonded to the first surface of the base layer, and an upper surface having a surface roughness Ra of 10 nm or less; and an insulating layer directly bonded to the upper surface of the flat layer.

A method of producing a heat dissipation substrate, the method including: providing a composite material containing diamond and a metal; performing a treatment on a surface of the composite material to reduce a thickness of the composite material, the treatment forming a processed surface of the composite material; and subsequently, performing pulsed electric current sintering with a pressure of less than 50 MPa applied to the composite material, to heat the composite material.

Method of producing heat dissipation substrate and method of producing composite substrate

A fluorescent member includes: a plurality of fluorescent particles; an inorganic binder; and a plurality of pores. An upper surface of the fluorescent member is a light extraction surface of the fluorescent member. The plurality of pores are localized in a vicinity of at least one of the plurality of fluorescent particles in a cross section that is parallel to the upper surface of the fluorescent member and extends through the fluorescent particles and the pores.

Fluorescent member, optical component, and light emitting device

A method of manufacturing a fluorescent-material-containing member includes: providing a fluorescent member including a fluorescent material, the fluorescent member having a first main surface side including a plurality of projections; disposing a powder of a light-reflective member between the projections of the fluorescent member; obtaining a sintered body by sintering the powder of the light-reflective member, and removing part of the sintered body from at least one of a first main surface side and a second main surface side of the fluorescent member to obtain the fluorescent-material-containing member including a first surface arranged on the first main surface side has and defined by the fluorescent member and the light-reflective member, and a second surface arranged on the second main surface side has and defined by the fluorescent member and the light-reflective member or defined solely by the fluorescent member.

Method of manufacturing fluorescent-material-containing member

In a method of manufacturing a phosphor-containing molded member, an inorganic powder in a mixture with a phosphor powder is melted by using Spark Plasma Sintering method, and then cooled. In a phosphor-containing molded member, a content of the phosphor therein is 5% by weight or more.

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Anan, Japan

Shoichi Yamada