Sumitomo Chemical Company, Limited

Shoichi Nezu

Hiroyuki Harada

Yuji Shigematsu

Kohji Kubo

Fumio Ishibashi

A resin composition for extrusion molding which has a melt flow rate (MFR) of from 0.5 to 30 g/10 min., having (A) 1 to 80 parts by weight of an ethylenic polymer which gives an endothermic peak in a temperature range of from 80.degree. to 120.degree. C. in a temperature rise thermogram as measured by a differential scanning calorimeter, has a melt flow rate (MFR) of from 0.5 to 50 g/10 min., and is prepared by high-pressure radical polymerization, (B) 5 to 80 parts by weight of a copolymer of ethylene and an .alpha.-olefine containing 3 to 12 carbon atoms which gives at least one endothermic peak in a temperature range of from 110.degree. to 130.degree. C. in the temperature rise thermogram as described above, has a melt flow rate (MFR) of from 0.5 to 30 g/10 min. and a density of from 0.900 to 0.935 g/cm.sup.3 and (C) 5 to 70 parts by weight of the copolymer of ethylene and an .alpha.-olefin containing 3 to 12 carbon atoms which has a melt flow rate (MFR) of from 0.5 to 30 g/10 min. and a density of from 0.870 to 0.920 g/cm.sup.3 in an unannealed state, and gives no endothermic peak at temperatures above 110.degree. C. in the temperature rise thermogram as described above, and in which a ratio of a main component is not less than 80%; which gives a packaging material having significantly improved properties such as heat sealability at low temperature, heat-sealing strength, hot tacking property and bag breaking strength, and exhibits an excellent extrusion processability such as film forming property and extrusion loading.

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Chiba, Japan

Shoichi Nezu