Murata Manufacturing Co., Ltd.

Murata Mfg. Co., Ltd.

Shoichi Kawabata

Norio Sakai

Kenji Kubota

Jiro Inoue

Toshiyuki Baba

Toshio Nishimura

Mitsuro Hamuro

Tsuyoshi Kitagawa

Mamoru Ogawa

Kenji Minowa

Takashi Mizuguchi

Shigeyoshi Matsuda

Hiromichi Wakatsuki

Toshihiko Unami

Eitaro Kameda

Yukio Tanaka

Toshihiko Kogame

Akihiko Takahashi

Toshimi Yoshimura

Miki Kurabe

Tsuyoshi Saitoh

Yuji Fujino

Toshiyuki Yasugi

Keiichi Okada

Motoo Kobayashi

Hisanao Tsuge

A method of producing a piezoeIectric resonator includes the steps of forming first to third internal electrodes by printing an electrically conductive paste onto a green sheet, punching out portions of the green sheet having the first to third internal electrodes formed thereon, so that at least three types of green sheets are punched out with a location of the internal electrode serving as a reference location, in which the first sheet is punched out by shifting a punching location by a first shift amount in a first direction with respect to the reference location, the second sheet is punched out by shifting a punching location by the first shift amount in a direction opposite to the first direction, and the third sheet is punched out at the reference location, forming a layered body by stacking the punched out green sheets, and forming a unit by cutting the layered body.

Method of producing multilayer piezoelectric resonator

A conductive cap for use in an electronic component, has an opening at a bottom portion thereof, and is constructed to be fixed to the upper surface of a substrate of the electronic component at the opening portion of the cap so as to cover at least an electronic component element mounted on the upper surface of the substrate having terminal electrodes provided thereon. The end surface of the opening and the inner and outer surfaces thereof in connection to and in the vicinity of the end surface are provided with an insulating film disposed thereon.

Conductive cap, electronic component, and method of forming insulating film of conductive cap

Method of forming insulating film of conductive cap by anodizing or electrodeposition

A method for adjusting the frequency of an electronic component device includes the step of etching an electrode disposed on a surface of the electronic component device by irradiating an ion beam onto the electrode. The ion beam irradiation is performed while moving at least one of the electronic component device and the ion beam in directions along the surface on which the electrode is disposed.

Method for adjusting frequency of electronic component

A piezoelectric resonance component includes a capacitor substrate, a piezoelectric resonator mounted on the capacitor substrate, and a cover member fixedly attached to the capacitor substrate. The capacitor substrate includes a dielectric substrate, a plurality of inner electrodes arranged in layers within the dielectric substrate, and a plurality of outer electrodes disposed on at least one of opposed side surfaces of the dielectric substrate. The plurality of inner electrodes include an inner electrode to be connected to a ground potential and a pair of split inner electrodes located at a common vertical position and spaced apart from each other with respect to a central portion of the dielectric substrate.

Piezoelectric resonance component

A piezoelectric resonator having a small spurious resonance and a large difference .DELTA.F between the resonant frequency and the antiresonant frequency has a compact size and an external electrode has a structure which prevents damage or breaking of the external electrode. The piezoelectric resonator has a substantially rectangular-parallelepiped base member which includes a plurality of laminated piezoelectric layers. A middle portion of the piezoelectric layers is polarized in opposite directions relative to each other. On main surfaces of the middle part of the piezoelectric layers, first and second groups of inner electrodes and are exposed alternately at both side surfaces of the base member. On both side surfaces of the base member, first and second external electrodes are arranged so as to alternately connect to the first and second groups of inner electrodes.

Piezoelectric resonator and electronic component including same

In order to provide a multilayer electronic component which can reduce arrangement pitches for external electrodes, via holes filled up with conductive materials are provided in a mother laminate, which is obtained by stacking a plurality of insulating sheets with interposition of conductor films, in positions parted by cutting. The conductive materials define external electrodes of individual multilayer electronic components which are obtained by cutting the mother laminate. No specific step is required for forming the external electrodes, and characteristics of each multilayer electronic component can be efficiently measured in the state of the mother laminate.

Method of manufacturing a multilayer electronic component

A multilayer electronic component having reduced arrangement pitches for external electrodes is formed by providing via holes in a mother laminate with conductive materials. The mother laminate is obtained by stacking a plurality of insulating sheets with interposition of conductor films in positions that are parted by cutting. The conductive materials define external electrodes for individual multilayer electronic components which are obtained by cutting the mother laminate. A specific step for forming the external electrodes is not required, and characteristics of each multilayer electronic component can be efficiently measured while each multilayer electronic component is still part of the mother laminate.

Multilayer electronic component

Method of measuring characteristics of a multilayer electronic component

Electronic parts are stuck into holes provided in an elongated retainer sheet and thereby retained. The retainer sheet as a transfer medium for the electronic parts is made to pass through a plating bath, a cleaning and drying section, an electrical characteristic measuring section, and a takeout section in turn. This allows the electronic parts 1 to be subjected to a plating process on their external electrodes, an electrical characteristic measuring process, and a taping process in a continuous manner. As a result, reduction in the number of handling manhours in the individual processes as well as space saving can be realized, while productivity can be improved.

Method for manufacturing chip-like electronic parts

When a plurality of ceramic green sheets provided with cavity holes are respectively pressed by an elastic member, rigid plates which are sized to be in contact with overall major surfaces of the respective ceramic green sheets and provided with holes equivalent to or slightly smaller than the cavity holes are interposed between the elastic member and the respective ceramic green sheets. Thus, the cavity holes are inhibited from undesired deformation caused by deformation of the elastic member.

Method of manufacturing cavitied ceramic multilayer block

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Kyoto, Japan

Shoichi Kawabata