Kaneka Corporation

Shohei Nishimori

Toshihiko Okamoto

Yoshio Furukawa

The present invention relates to a curable resin composition comprising a polyol (A) having an average hydroxyl value of 200 to 1500 mg KOH/g, a polyisocyanate (B), and polymer fine particles (C), and a curable resin composition comprising a polyol (A), a polyisocyanate (B), and polymer fine particles (C), wherein the polyol (A) comprises a polyester polyol (a2) as an essential component, and the amount of the polyester polyol (a2) is not less than 20 parts by mass per 100 parts by mass of the polyol (A).

Curable resin composition, structural adhesive, coating material or fiber reinforced composite material using the same, foam body using the same, laminate using the same, and cured material thereof

The present invention relates to a core-shell polymer-containing epoxy resin composition, wherein the composition contains 100 parts by weight of the epoxy resin (A) and 1 to 100 parts by weight of the core-shell polymer (B), the core-shell polymer has the volume average particle diameter of 0.01 to 1 &#x3bc;m, the core part of the core-shell polymer (B) has the glass transition temperature of less than 0&#xb0; C., the shell part of the core-shell polymer (B) has the glass transition temperature of less than 25&#xb0; C., and the shell part of the core-shell polymer (B) is polymerized with at least a monomer having an epoxy group.

Core-shell polymer-containing epoxy resin composition, cured product thereof and method for preparing the same

The present invention relates to a curable resin composition containing 100 parts by mass of an epoxy resin (A), 1 to 100 parts by mass of polymer fine particles (B), and 1 to 100 parts by mass of a blocked urethane (C), wherein the polymer fine particles have a core-shell structure of a core layer and a shell layer, the core layer contains diene rubber, the shell layer contains at least a hydroxyl group, and the content of the hydroxyl group of the polymer fine particles (B) is 0.01 to 0.8 mmol/g.

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Takasago, Japan

Shohei Nishimori