Hitachi Metals, Ltd.

Hitachi, Ltd.

Hitachi Kyowa Engineering Co., Ltd.

Hitachi Cable, Inc.

Proterial, Ltd.

Opnext Japan, Inc.

Hitachi-high-technologies Corporation

Hitachi Automotive Systems, Ltd.

Shohei Hata

Hiromitsu Kuroda

Naoki Matsushima

Keisuke Fujito

Kazuya Nishi

Toru Sumi

Takayuki Tsuji

Toshiaki Takai

Eiji Sakamoto

Yukio Sakigawa

Keiichi Yamada

Kazumi Kawamoto

Hiroaki Furuichi

Atsushi Kazama

Takashi Hayasaka

Hideo Sotokawa

Kazuma Kuroki

Takeshi Usami

Takuto Yamaguchi

Yuichi Oda

Takeru Fujinaga

Takayuki Tuji

Osamu Ikeda

Yoshinori Sunaga

Hiroki Yasuda

Kouki Hirano

Kisho Ashida

Masahide Okamoto

Takanori Aono

Hanae Shimokawa

Satoshi Arai

Ryoji Okada

Hideyuki Kuwano

Hideaki Takemori

Katsumi Kuroguchi

Masayuki Hio

Yoshiaki Niwa

Kentarou Miyajima

Atsuo Soma

Kazuhisa Takahashi

Masatoshi Seki

Masahiro Hirai

Junji Onozuka

Toshiki Kida

Hiroyuki Oota

Atsuhiro Yamamoto

Tsutomu Okumura

Kazuo Takai

Susumu Ishida

A manufacturing efficiency of the wire rod made of the cast alloy including the additive element having the high activity to the oxygen is improved. An apparatus of manufacturing a wire rod includes: a tundish storing a molten metal; a mold for use in continuously casting the molten metal fed from the tundish; and an additive-element feeding unit continuously feeding an additive element (wire) to a feeding port of the mold.

Method of manufacturing wire rod and apparatus of manufacturing wire rod

Recrystallization of an aluminium alloy wire material is suppressed while a heat resistance of the same is improved. In a wire material made of an aluminium alloy, an aluminium alloy wire material is provided, the aluminium alloy containing Zr of 0.2 to 1.0 mass %, Co of 0.1 to 1.0 mass % and remainders that are aluminium and unavoidable impurities, and the aluminium alloy wire material having a tensile strength at a room temperature that is equal to or higher than 170 MPa, an elongation that is equal to or higher than 10%, and a stress at time of tensile deformation at a strain speed of 10/sec under a temperature condition of 250&#xb0; C. that is equal to or higher than 40 MPa.

Aluminum alloy wire material

Bendability of a copper alloy wire is improved without decrease in an electrical conductivity of the copper alloy wire made of copper alloy containing zirconium. A cable includes: a two-core stranded wire formed by intertwining two electrical wires made of a conductor and an insulating layer covering the conductor; a filler formed around the two-core stranded wire; and a sheath formed around the filler and the electrical wire. The conductor is a copper alloy wire in which a precipitate containing the zirconium disperses, and has a crystal gain diameter that is equal to or smaller than 1 &#x3bc;m, an electrical conductivity that is equal to or higher than 87% IACS, and a tensile stress that is equal to or larger than 545 MPa.

Copper alloy wire, cable, and method of manufacturing copper alloy wire

An insulated electric wire is composed of a conductor composed of a copper material, and an electrical insulating layer provided on an outer periphery of the conductor. For the constituent conductor of the insulated electric wire, in an orientation intensity ratio obtained by X-ray diffraction of a transverse cross section of the conductor, an intensity in a [200] crystal orientation is higher than an intensity in a [111] crystal orientation.

Insulated electric wire, coil and producing method for same coil

A wire rod made of an aluminum alloy. The aluminum alloy includes Al crystal grains, an Al&#x2014;Zr compound, and an Al&#x2014;Co&#x2014;Fe or Al&#x2014;Ni&#x2014;Fe compound. The aluminum alloy includes high-angle tilt crystal grain boundaries, each of which has a difference between crystal orientations in both its sides of 15 degrees or more, and low-angle tilt crystal grain boundaries, each of which has a difference between crystal orientations in both its sides of 2 degrees or more and less than 15 degrees. An average grain diameter of ones of the Al crystal grains surrounded by the high-angle boundaries is 12 &#x3bc;m or more. An average grain diameter of the ones of the Al crystal grains surrounded by the high-angle boundaries, ones of the Al crystal grains surrounded by the high-angle boundaries and the low-angle boundaries, and ones of the Al crystal grains surrounded by the low-angle boundaries, is 10 &#x3bc;m or less.

Aluminum alloy wire rod and producing method therefor

An insulated wire includes a conductor including a copper material, and an insulation layer that is formed on an outer periphery of the conductor. A restoring temperature Tof the conductor is not more than 130&#xb0; C. The restoring temperature Tis a temperature that is needed to restore a conductivity of the conductor after a coil processing to a conductivity of the conductor before the coil processing.

Insulated wire, coil and method for manufacturing the coil

An aluminum alloy wire rod has a chemical composition consisting of 0.1 to 1.0 mass % of Co, 0.2 to 0.5 mass % of Zr, 0.02 to 0.09 mass % of Fe, 0.02 to 0.09 mass % of Si, 0 to 0.2 mass % of Mg, 0 to 0.10 mass % of Ti, 0 to 0.03 mass % of B, 0 to 1.00 mass % of Cu, 0 to 0.50 mass % of Ag, 0 to 0.50 mass % of Au, 0 to 1.00 mass % of Mn, 0 to 1.00 mass % of Cr, 0 to 0.50 mass % of Hf, 0 to 0.50 mass % of V, 0 to 0.50 mass % of Sc, 0 to 0.50 mass % of Ni, the balance being Al and inevitable impurities, and a metal structure including Al crystal grains, an Al&#x2014;Co&#x2014;Fe compound and an Al&#x2014;Zr compound. The Al crystal grains having a crystal grain diameter of 10 &#x3bc;m or less have an area ratio of 90% or more. The wire rod has a tensile strength of 150 MPa or more, an electrical conductivity of 55% IACS or more and when heated at 200 deg C. for 10 years, a strength of 90% or more of its initial state strength.

Aluminum alloy wire rod and producing method thereof

A copper alloy material manufacturing equipment for manufacturing a copper alloy material by continuously casting molten copper. The equipment includes an element adding means for adding a metal element to the molten copper, a tundish for holding the molten copper containing the metal element, a pouring nozzle connected to the tundish to feed the molten copper from the tundish, and a trapping member arranged inside the tundish and including a same type of material as at least one of an oxide of the metal element, a nitride of the metal element, a carbide of the metal element and a sulfide of the metal element.

Equipment and method for manufacturing copper alloy material

A copper alloy material production method is provided. A copper raw material including not higher than 30 ppm by mass of oxygen is melted to form a molten copper. Not lower than 4 ppm by mass and not higher than 55 ppm by mass of titanium is added to the molten copper. After the adding of the titanium, not lower than 100 ppm by mass and not higher than 7000 ppm by mass of magnesium is added.

Copper alloy material and production method therefor

A mechanical quantity measuring device includes: a sensor chip having a strain detector formed on a surface of a semiconductor substrate and a plurality of electrodes connected to the strain detector; a stem having ascot that protrudes from an adjacent peripheral portion and has an upper surface that is attached to a lower surface of the sensor chip by a bonding material formed from a metallic material or a glass material; a lead-out wiring part including a plurality of wires that are electrically connected to the plurality of electrodes; and a fixing part for fixing the stem, wherein: the stem and the fixing part are integrally molded or fixed through metallic bonding or mechanical bonding.

Mechanical quantity measuring device and sensor unit

It is an objective of the invention to provide an Al alloy conductor exhibiting mechanical properties and heat resistance that are balanced at a higher level than conventional Al alloy conductors while having an electrical conductivity comparable to that of any conventional Al-based material. There is provided an Al alloy conductor formed of an Al alloy. The Al alloy has a chemical composition including Co of 0.1 mass % or more and 1 mass % or less, at least one of Sc of 0.1 mass % or more and 0.5 mass % or less and Zr of 0.2 mass % or more and 0.5 mass % or less, and the balance made up of Al and inevitable impurities. The Al alloy conductor has a matrix containing fine particles of a compound of at least one of the Sc and the Zr with the Al. The fine particles are dispersedly precipitated in the matrix.

Aluminum alloy conductor, insulated wire including the conductor, and method for manufacturing the insulated wire

The disclosed junction material, manufacturing method thereof, and manufacturing method of junction structure utilize lead-free materials and ensure a high reliability of the junction between a semiconductor element and a frame or substrate, or, between a metal plate and another metal plate. For junctions between a semiconductor element and a frame or substrate, by using as the JUNCTION MATERIAL a laminate material comprising a Zn-based metallic layer (), Al-based metallic layers () on both sides thereof, and X-based metallic layers () (X=Cu, Au, Ag or Sn) on the outside of both the Al-based metallic layers (), even in an oxygen-rich environment, the superficial X-based metallic layers protect the Zn and Al from oxidation until said junction material melts, preserving the wettability and bondability of said junction material as solder and securing the high reliability of the junction.

Junction material, manufacturing method thereof, and manufacturing method of junction structure

A photoelectric conversion module includes: a substrate having a light transmitting property and having a mounting surface; a photoelectric conversion element mounted on the mounting surface of the substrate; a cover member fixed to the substrate via a solder layer constituted by solder and forming, cooperatively with the substrate, an airtight chamber housing the photoelectric conversion element; and a solder adsorbing film provided near an area fixed to the substrate by the solder layer, in a surface, of the cover member, facing the mounting surface, the solder having an adhesive property to the solder adsorbing film.

Photoelectric conversion module

To provide an inexpensive lead component which can be easily connected to a semiconductor chip and which has satisfactory connectability. There is provided a lead component including a base material having a connection part for connecting to a semiconductor chip, comprising: a solder part having a Zn layer made of a Zn-bonding material rolled and clad-bonded on the base material, and an Al layer made of an Al-bonding material rolled and clad-bonded on the Zn layer, in a prescribed region including the connection part on the base material; and the solder part further comprising a metal thin film composed of one kind or two kinds or more of Au, Ag, Cu, Ni, Pd, and Pt covering a surface of the Al layer.

Lead component and method for manufacturing the same, and semiconductor package

An optical module in a simple configuration is provided which can suppress optical crosstalk due to leakage light without causing characteristics deterioration and reliability decrease of light-emitting elements to thereby obtain appropriate light receiving sensitivity. In an optical module in which a plurality of light-emitting elementsand light-receiving elementsare mounted on an optical-element mounting substrate, a light-absorbing resinto absorb light with a light-emission wavelength of the light-emitting elementsis arranged to cover side surfaces of the light-emitting elementsand a non-adhesive layerincluding a material not adhesive to the light-absorbing resinis arranged between the light-absorbing resinand the optical-element mounting substrate

Optical module

Growing community of inventors

Yokohama, Japan

Shohei Hata