Fujimi Incorporated

Shogo Tsubota

Keiji Ashitaka

Masaaki Ito

Jun Shinoda

Robert Hepburn

Yusuke Kawasaki

Kazusei Tamai

Naoya Miwa

Souma Taguchi

Provided is a method for producing a porous metal oxide. The method includes: preparing a slurry by mixing a metal source, a pore forming agent and an aqueous solvent; drying the slurry to obtain a metal oxide precursor; and sintering the metal oxide precursor to generate a porous metal oxide. The metal source is an organometallic compound or hydrolyzate thereof containing a metal that makes up the porous metal oxide; the pore forming agent is an inorganic compound that generates a gas by decomposing at a temperature equal to or lower than a temperature at which the metal oxide precursor is sintered; and the slurry is prepared using 50 parts by weight or more of the pore forming agent with respect to 100 parts by weight of the metal source.

Method for producing porous metal oxide

The present invention provides a means capable of suppressing the formation of fine particles in a method for producing a silica sol. The present invention relates to a method for producing a silica sol, including synthesizing a silica sol by, in a reaction liquid containing an alkoxysilane or a condensate thereof, water, and an alkali catalyst, allowing the alkoxysilane or condensate thereof to react with the water in the presence of the alkali catalyst, wherein the alkali catalyst is not additionally supplied after the start of the synthesis until the finish time of the synthesis, and during 90% or more of the time between when 5 minutes have elapsed from the time point when the electrical conductivity of the reaction liquid reaches a local maximum for the first time and the finish time of the synthesis, the proportion of the value of the electrical conductivity of the reaction liquid is more than 90% relative to the value of the electrical conductivity at the time when 5 minutes have elapsed from the time point when the local maximum is reached.

Method for producing silica sol

To provide modified colloidal silica capable of improving the stability of the polishing speed with time when used as abrasive grains in a polishing composition for polishing a polishing object that contains a material to which charged modified colloidal silica easily adheres, such as a SiN wafer, and to provide a method for producing the modified colloidal silica. Modified colloidal silica, being obtained by modifying raw colloidal silica, wherein

Modified colloidal silica and method for producing the same, and polishing agent using the same

To provide modified colloidal silica capable of improving the stability of the polishing speed with time when used as abrasive grains in a polishing composition for polishing a polishing object that contains a material to which charged modified colloidal silica easily adheres, such as a SiN wafer, and to provide a method for producing the modified colloidal silica. Modified colloidal silica, being obtained by modifying raw colloidal silica, wherein the raw colloidal silica has a number distribution ratio of 10% or less of microparticles having a particle size of 40% or less relative to a volume average particle size based on Heywood diameter (equivalent circle diameter) as determined by image analysis using a scanning electron microscope.

According to the present invention, there is provided a means for producing an aluminum hydroxide-coated SiC particle powder having a coating layer containing aluminum hydroxide on a surface of SiC particles. The present invention relates to a method for producing an aluminum hydroxide-coated SiC particle powder, which includes a coating step of maintaining a pH of a dispersion containing SiC particles, sodium aluminate, and water in a range of from 9 to 12 and forming coated particles having a coating layer containing aluminum hydroxide on a surface of the SiC particles.

Method for producing aluminum hydroxide-coated silicon carbide particle powder and method for producing dispersion containing the same powder and dispersing medium

Disclosed herein is a polishing composition comprising a pH of 6 or less, sulfonic acid-modified colloidal silica obtained by immobilizing sulfonic acid on surfaces of silica particles, and water, wherein the sulfonic acid-modified colloidal silica is derived from sulfonic acid-modified aqueous anionic silica sol produced by a production method comprising: a first reaction step of obtaining a reactant by heating raw colloidal silica having a number distribution ratio of 10% or less of microparticles having a particle diameter of 40% or less relative to a volume average particle diameter based on Heywood diameter (equivalent circle diameter) as determined by image analysis using a scanning electron microscope in the presence of a silane coupling agent having a functional group chemically convertible to a sulfonic acid group; and a second reaction step of converting the functional group to a sulfonic acid group by treating the reactant.

Polishing composition

A polishing composition of the present invention contains abrasive grains each having a surface with protrusions. Parts of the abrasive grains have larger particle diameters than the volume-based average particle diameter of the abrasive grains, and the average of values respectively obtained by dividing a height of each protrusion on the surface of each abrasive grain belonging to the parts of the abrasive grains by the width of a base portion of the same protrusion is 0.170 or more. Protrusions on the surfaces of abrasive grains belonging to the parts of the abrasive grains that have larger particle diameters than the volume-based average particle diameter of the abrasive grains have an average height of 3.5 nm or more. The polishing composition has a content of an organic alkali of 100 mmol or less per kilogram of the abrasive grains in the polishing composition.

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Kiyosu, Japan

Shogo Tsubota