Mitsubishi Electric Corporation

Canon Kabushiki Kaisha

Shogo Shibata

Shuhei Yokoyama

Maki Hasegawa

Naoki Ikeda

Shigeru Mori

Toru Iwagami

Koichi Masegi

Minoru Fujita

Kazuki Koda

Hiroyuki Nakamura

Makoto Hirota

Yuji Ikeda

Koichiro Noguchi

Fumiaki Itoh

Takaya Ueda

Keitaro Ichikawa

Kosuke Yamaguchi

Seiya Sugimachi

Hongbo Zhang

Yoshihiro Tokuume

A semiconductor device includes: semiconductor elements; a package sealing the semiconductor elements and being rectangular in a top view; control terminals protruding from a first side of the package; output terminals protruding from a second side facing the first side of the package; and a recessed portion formed in a third side adjacent to the first side and the second side of the package, wherein a part of the control terminals is disposed at end portions of lead frames, the semiconductor device further includes dummy terminals disposed at other end portions of the lead frames, respectively, the dummy terminals protruding from the recessed portion, and an amount of the protrusion of each of the dummy terminals from the recessed portion is smaller than or equal to 0.75 mm.

Semiconductor device

A semiconductor device includes: a semiconductor element; a mold member covering the semiconductor element; and a first terminal and a second terminal electrically connected to the semiconductor element, protruding from one side of the mold member, and alternating along the one side. The first terminal includes a first bend, and the second terminal includes: a second bend located further from the one side of the mold member than the first bend, and having the same width as the first bend in plan view.

Semiconductor device with bent terminals

The plurality of control terminals are drawn out from the first side surface of the sealing resin. The plurality of main terminals are drawn out from the second side surface of the sealing resin. Each of the main terminals includes, in the sealing resin, a bonding section wire-connected to one of the semiconductor chips, a heat transfer section adjacent to the bonding section, and a mounting section on which the other one of the semiconductor chips is mounted. A concave section is provided on the second side surface between the main terminals adjacent to each other. A side surface of the heat transfer section is opposed to the concave section. A side surface of the bonding section is not opposed to the concave section.

Semiconductor device and power conversion device

A manufacturing method of a semiconductor device according to the technology disclosed in the present specification includes: providing at least one semiconductor element; connecting, to the semiconductor element, a plurality of first terminals and at least one second terminal that is a control terminal to which a voltage lower than that of the first terminal is applied; and forming a first bent part in the first terminal, in which the first bent part does not protrude on the surfaces, facing each other, of the plurality of first terminals that are adjacent to each other.

Manufacturing method of semiconductor device and semiconductor device

A method for manufacturing a semiconductor device according to the present invention includes the steps of (a) preparing a lead frame including a power chip die pad to which two terminals are connected, a control element die pad to which one terminal is connected, and tie bar portions connecting between a plurality of terminals including the two terminals, (b) placing a power chip and a free wheel diode on the power chip die pad and placing ICs on the control element die pad, (c) encapsulating in a mold resin to allow the tie bar portions to be exposed outside and a plurality of terminals including the two terminals and the one terminal to protrude outward, and (d) removing the tie bar portions other than the tie bar portions connecting the two terminals.

Method for manufacturing semiconductor device and semiconductor device

A semiconductor module includes: a semiconductor element; a first lead frame including a first portion on which the semiconductor element is mounted; a sealing member sealing the semiconductor element and the first portion; and a heat dissipation member which is integrated with the sealing member and dissipates heat generated in the semiconductor element. The heat dissipation member is insulated from the semiconductor element and the first portion by the sealing member. Therefore, the semiconductor module that is applicable to vertical semiconductor elements and ensures electrical insulation between the semiconductor element and the heat dissipation member when implementing the semiconductor module onto a circuit board, can be provided.

Semiconductor module and semiconductor device

The present invention is a semiconductor module including: first and second drive circuits that perform drive control of at least one pair of first and second switching devices, in which the at least one pair of first and second switching devices and the first and second drive circuits are sealed in a package having a rectangular shape in plan view, and there are provided: a control terminal provided to protrude from a side surface of a first long side out of first and second long sides of the package, and to which a control signal of the first and second drive circuits is inputted; an output terminal provided to protrude from a side surface of the second long side; a first main terminal provided to protrude from a side surface of a first short side out of first and second short sides of the package; and a second main terminal provided to protrude from a side surface of the second short side.

Package and terminal arrangement for semiconductor module

A semiconductor module includes: a semiconductor chip; a package sealing the semiconductor chip; and a plurality of terminals connected to the semiconductor chip and protruding from the package, wherein the plurality of terminals includes a plurality of first terminals arranged side by side at a first pitch, and a plurality of second terminals arranged side by side at a second pitch, each terminal has a base portion, a tip portion narrower than the base portion, and a connection portion connecting the base portion and the tip portion, the connection portions of the plurality of first terminals are right-angled, and the connection portions of the plurality of second terminals are arc-shaped.

Semiconductor module using lead frame for power and control terminals and both having asymmetric or inhomogenous configuration

A power module includes a connection terminal for external connection, the connection terminal protruding from the side surface of a package, and a dummy terminal protruding from the side surface of the package and shorter than the connection terminal. The dummy terminal is processed to have a bottom surface with an inclination. In other words, the distance between a plane containing a heat dissipation surface of the package and the dummy terminal increases toward the extremity of the dummy terminal. Accordingly, when a heat dissipation fin is attached to the heat dissipation surface, the extremity of the dummy terminal is more distant from the heat dissipation fin than the rest of the dummy terminal.

Power module with dummy terminal structure

A document processing apparatus and method extracts, from document data, both a first word, whose translation is to be determined, and a second word that is either the preceding word or the subsequent word of the first word. Then a keyword is extracted based on the frequency of occurrence of the first word and the keyword is translated into a predetermined language by referring to a dictionary in a process that considers a meaning of the first and second words existing together in the document data.

Document processing method and apparatus therefor for translating

A system and method for generating a sentence from an inputted semantic representation includes a memory for storing a limitation which a generated sentence should satisfy generator, a generating sentence from the inputted semantic representation based upon the stored limitation, an evaluator for evaluation the generated results, and an altering device for altering the stored limitation based upon the evaluation. A cycle composed of sentence generation, evaluation of the generated sentence and alteration of the limitation is repeated until the evaluation satisfies a predetermined criterion.

Sentence generating system

A natural language arrangement includes stored grammatical rules each having a phrase structure part representing grammatical functions, a semantic part representing the manner of propagation from a superordinate category to a subordinate category, a condition part, and a message part that imposes limitations on a phrase structure rule using the subordinate category as a superordinate category. The grammatical rules are searched and interpreted to generate a phrase structure for a sentence from grammatical function information obtained by interpreting and applying the searched grammatical rules.

Growing community of inventors

Tokyo, Japan

Shogo Shibata