Sony Corporation

Sony Semiconductor Solutions Corporation

Taiyo Ink Mfg. Co., Ltd.

Shogo Ono

Manabu Tomita

Minoru Kohno

Takeo Eguchi

Koichi Igarashi

Takaaki Miyamoto

Kazuyasu Takenaka

Takaaki Murakami

Iwao Ushinohama

Toru Tanikawa

Atsushi Nakamura

Yuichiro Ikemoto

Shota Nishi

Shigeyoshi Hirashima

Yuji Yakura

Atsushi Nakayama

Manabu Matsuda

Osamu Tateishi

Shigeyoshi Fujiki

Masato Nakamura

Masahiko Shimizu

Shigeru Ushiki

Shohei Makita

Takaai Miyamoto

Toshimitsu Sato

The present technology relates to a semiconductor device and a method of manufacturing the semiconductor device that enable prevention of generation of tape scraps from the dicing tape during dicing, and an electronic apparatus. When a semiconductor substrate on which a protective film for protecting a circuit surface is formed is divided, dicing is performed so as to form a portion in which the section width of the semiconductor substrate differs from the section width of the protective film. The present technology can be applied to a wafer level CSP manufacturing process and the like, for example.

Semiconductor device and method of manufacturing the same, and electronic apparatus

When a semiconductor package is stored in a transport tray and when a semiconductor package is transported by a transport tray, the semiconductor package comes into contact with the side wall of the transport tray, so that the end face of the semiconductor package is chipped and dust is generated from the end face of the semiconductor package. Provided is a technology for a semiconductor package that includes a multilayer structure having at least a synthetic resin layer and includes an outermost edge portion such that the end face of the synthetic resin layer protrudes outward compared to the end faces of the other layers constituting the multilayer structure.

Semiconductor package having a multilayer structure and a transport tray for the semiconductor structure

Provided are an imaging device that enables formation of a film over the entirety of a film formation region, a method of producing the imaging device, an imaging apparatus, and an electronic apparatus. The imaging device includes a sensor and a glass sheet bonded to a front surface of the sensor. The glass sheet includes a recess in a peripheral portion that is outside a film formation region over which an inorganic film is to be formed. The recess corresponds to a claw on a periphery of an opening of a tray for a vapor deposition process for the inorganic film. This allows the entirety of the film formation region of the glass sheet to be exposed from the opening when the imaging device is set in the opening, and thus enables formation of the inorganic film over the entirety of the film formation region.

Imaging device, method of producing imaging device, imaging apparatus, and electronic apparatus

A liquid ejection head includes an energy-generating element arranged on a semiconductor substrate, a barrier layer deposited on the semiconductor substrate for forming a liquid chamber in the periphery of the energy-generating element, and a nozzle sheet bonded on the barrier layer and having a nozzle formed at a position opposing the energy-generating element, in which the liquid ejection head ejects liquid contained in the liquid chamber from the nozzle as liquid droplets by the energy-generating element, and the barrier layer is provided with a plurality of depressions, each having an independent contour, arranged within a range, which is separated from the border of the barrier layer, on an adhesive region adhering to the nozzle sheet.

Liquid ejection head, liquid ejection apparatus, and manufacturing method of liquid ejection head

There is provided a head including a chipthat has a semiconductor substrate, heating elementsdisposed on the semiconductor substrate, coating layersdisposed on the semiconductor substrateand having nozzlesarranged in regions above the respective heating elements, and individual channelseach communicating with the outside and the region above the corresponding heating element, wherein the semiconductor substratedoes not have a through hole communicating with each individual channel; a ink feed memberhaving a common channel, the ink feed memberbeing bonded to the chipin such a manner that the common channelcommunicates with the individual channels; and a topdisposed on the chipand the ink feed memberso as to seal the opening of the common channel

Liquid discharging apparatus and method for manufacturing liquid discharging apparatus

A liquid ejecting head includes a plurality of liquid ejecting portions arrayed in a flat region on a substrate. The liquid ejecting portions each include a liquid chamber that accommodates liquid to be ejected, a heater element arranged in the liquid chamber, the heater element generating bubbles in liquid in the liquid chamber when heated, and a nozzle for ejecting liquid in the liquid chamber in accordance with generation of bubbles by the heater element.

Liquid ejecting head and liquid ejecting apparatus

A liquid discharge recording head which discharges a liquid includes a substrate on which liquid-discharge-energy-generating elements are provided and which constitutes a part of a flow path for supplying the liquid; and a covering resin layer which is provided on the substrate, which constitutes a part of the flow path, and which includes orifices for discharging the liquid, wherein the covering resin layer is composed of an oxetane resin composition containing an oxetane compound having at least one oxetanyl group in its molecule and a photocationic polymerization initiator as essential components.

Liquid discharge recording head having an improved oxetane resin covering layer as part of a liquid flow path and liquid discharge apparatus

In a method and an apparatus for ejecting liquid, the processing accuracy of an ejection unit for ejecting ink can be easily increased and the variations in the volume of ink drops, the ejection angle thereof, etc., can be reduced even when dust is mixed in ink. In addition, a reduction in an ink-supply speed at which ink is supplied to an ink ejection unit can be prevented. An ink ejection apparatus includes a plurality of heating units () provided on a base member (), ink cells for pressurizing ink with energy generated by the heating units (), and nozzles () having ejection holes for ejecting the ink which is pressurized in the ink cells. Each of the nozzles () is disposed above each of the heating units (). In addition, first open sides of the nozzles () which face the heating units () serve as ink inlets () and second open sides of the nozzles () serve as the ejection holes (), so that inner spaces of the nozzles () serve as the ink cells, the ink cells not being provided separately.

Method and apparatus for ejecting liquid

A head module includes lines of head chips, each head chip having energy-generating elements for discharging liquid and electrodes for electrically connecting the energy-generating elements to a control substrate, and a wiring board having wires for electrically connecting the electrodes to the control substrate. The head module drives the energy-generating elements through the wiring board to discharge liquid. The wiring board includes connecting sections connecting the wires to the respective electrodes, common wire sections joining some of the wires that are common to the head chips, and a terminal section connecting the wires to the control substrate at one side of the wiring board. The wires in the connecting and terminal sections are arranged in a single-layer structure along a horizontal direction. The wires in the common wire sections are arranged in a multi-layer structure in which portions of the wires are stacked in the vertical direction.

Head module, liquid discharge head, and liquid discharge apparatus

Disclosed is a liquid ejecting recording head with improved operational reliability. A first coating resin layer of a liquid ejecting recording head, having a liquid flow duct and a liquid ejecting orifice, is formed of an oxetane resin composition that contains, as necessary components, an oxetane compound having at least one oxetanyl group in a molecule, and a cationic photopolymerization initiator.

Method for producing liquid ejecting recording head

A flow path structure includes a heating element, a barrier layer, a liquid chamber formed by a part of the barrier layer and a pair of walls confronting each other to hold the heating element therebetween and a first individual flow path and a second individual flow path disposed on both the sides of the liquid chamber to communicate with the liquid chamber, a liquid is supplied to the liquid chamber from at least one of first and second individual flow paths, and the distance U between the walls in the liquid chamber and the flow path width W of the first individual flow path are set to satisfy U&#x3e;W. With this arrangement, a flow path structure can be provided in which a failure in flow paths due to dusts is unlike to occur and which minimizes the influence of bubbles and has almost no uneven ejection.

Liquid ejection head and liquid ejection device

Flying characteristics of ink droplets are controlled efficiently to the utmost. In one liquid chamber, two heating elements with the same surface-shape and the same heating characteristics are juxtaposed. While energy is simultaneously applied to the two heating elements, by applying energy with different energy surface-densities to the two heating elements so that the bubble-generating time with film boiling differs for the two heating elements, the liquid droplets are controlled so that a flying force with a component parallel to an ejection face of a nozzle is applied to the liquid droplets in a growing process of the liquid droplets.

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Kanagawa, Japan

Shogo Ono