Matsushita Electric Industrial Co., Ltd.

Panasonic Intellectual Property Management Co., Ltd.

Panasonic Corporation

Shogo Nakayama

Seiji Tsuda

Kazutoshi Matsumura

Takeshi Iseki

Eiichi Uriu

Atsushi Shinkai

Hironobu Chiba

Tomoyuki Washizaki

Takeshi Orita

Hironori Motomitsu

Naohiro Takashima

Kazuo Oishi

Hiroshi Fujii

Hideki Tanaka

Masato Hashimoto

Akio Fukuoka

Tsutomu Inuzuka

Yuji Yasuoka

Naohiro Mikamoto

Fuyuki Abe

Koji Nishimura

Akimitsu Fujii

Koichi Yamada

Takumi Shirai

Shoji Mori

In a metal plate resistor according to the present disclosure, each of a pair of electrodes includes a first portion and a second portion. The first portion protrudes from one surface of a resistive element to be in contact with an end of a protection film. The second portion is disposed in a corresponding recess of a pair of recesses. In a direction in which the pair of electrodes is arranged, the second portion has a length longer than a length of the first portion.

Metal plate resistor and manufacturing method thereof

A chip resistor having a predetermined resistance value is manufactured by the following method. A resistive element is provided on an upper surface of an insulating substrate. The resistive element includes a wide portion, a first narrow portion extending from the wide portion, and a part extending from the wide portion, the first narrow portion has a smaller width than the wide portion. First and second electrodes are provided on the upper surface of the insulating substrate. The first electrode is located away from the wide portion. The first electrode contacts the first narrow portion. The first electrode overlaps the first narrow portion when viewed from above. The second electrode contacts the part of the resistive element. The second electrode overlaps the part of the resistive element when viewed from above. A distance between the narrow portion and the wide portion is determined so as to cause a resistance value between the first and second electrodes to be the predetermined resistance value. This method improves the precision of the resistance value of the chip resistor.

Chip resistor manufacturing method, and chip resistor

A resistor includes a resistive element, a protective film, and a pair of electrodes. The resistive element is made of a metal plate. The protective film is formed on the upper surface of the resistive element. The plated layers are formed to cover the electrodes. The electrodes are separated from each other with the protective film therebetween and are formed at both ends of the upper surface of the resistive element. The electrodes are formed by printing metal-containing paste.

Resistor and method for manufacturing same

A resistor includes a resistive element, a first resin substrate on an upper surface of the resistive element and having a high thermal conductivity, a first heat radiator plate made of metal provided on an upper surface of the first resin substrate, a second heat radiator plate made of metal provided on the upper surface of the first resin substrate, a first edge-surface electrode provided on the first edge surface of the resistive element and connected to the first heat radiator plate, and a second edge-surface electrode provided on the second edge surface of the resistive element and connected to the second heat radiator plate.

Resistor

A chip resistor includes an insulating substrate, a resistive element provided on an upper surface of the insulating substrate, a pair of upper-surface electrodes provided on respective ones of both end portions of an upper surface of the resistive element so as to expose a part of the upper surface of the resistive element from the upper-surface electrodes, and a protective layer that covers the part of the resistive element and that does not cover the pair of upper-surface electrodes. The pair of upper-surface electrodes have exposed upper surfaces and exposed edge surfaces, respectively. Each of the edge surfaces of the pair of upper-surface electrodes does not project outward from respective one of the edge surfaces of the insulating substrate. The chip resistor can reduce a temperature coefficient of resistance to improve the temperature coefficient of resistance.

Chip resistor and method for manufacturing same

A common mode noise filter includes a nonmagnetic layer, first and second magnetic layers sandwiching the nonmagnetic layer between the magnetic layers and contacting the nonmagnetic layer, a plane coil provided between the first and second magnetic layers and contacting the nonmagnetic layer, and an external electrode connected electrically with the plane coil. The first and second magnetic layers include a magnetic oxide layer and an insulator layer provided on the magnetic oxide layer. The insulator layer contains glass component. This common mode noise filter has a large bonding strength between the external electrode and the insulator layer.

Common mode noise filter

A common mode noise filter includes a first insulating layer made of magnetic material, a first conductor on the first insulating layer, a second insulating layer located on the first conductor and made of nonmagnetic material, a second conductor having a spiral shape on the second insulating layer and connected with the first conductor, a third insulating layer located on the second conductor and made of nonmagnetic material, a third conductor having a spiral shape provided on the third insulating layer, a fourth insulating layer located on the third conductor and made of nonmagnetic material, a fourth conductor connected with the third conductor, a fifth insulating layer provided on the fourth conductor and made of magnetic material. The first conductor and the second conductor provide a first coil. The third conductor and the fourth conductor provide a second coil. The third insulating layer is thicker than the second insulating layer and the fourth insulating layer. This filter can increase impedance of the first and second coils against common mode components.

Comprising a magnetic memberformed by laminating magnetic sheetsa first impedance elementformed in the magnetic memberand a second impedance elementformed above the first impedance elementthe first impedance elementincludes a first normal impedance elementand a first common impedance elementand the second impedance elementincludes a second common impedance elementand a second normal impedance element

Noise filter and electronic device using noise filter

In a noise filter having a large impedance in a common mode, a first conductor and a second conductor provided on first magnetic sheets and have spiral shapes of plural turns and spaced from each other for avoiding short-circuit. The first conductor is provided inside the spiral shape of the second conductor. The other end of the first inner conductor is located adjacent to the other end of the second inner conductor. The respective other ends of the first inner conductor and the second inner conductor on the magnetic sheet are connected at the respective other ends to first and second conductors provided on another magnetic sheet.

Noise filter and electronic apparatus comprising this noise filter

A resistor has a low resistance which precisely falls within a prescribed range regardless of the variation in the contact position of the probes. The resistor comprises a substrate, a pair of upper-surface electrode layers having respectively a notched section, provided on both sides of upper surface of the substrate, a resistor layer provided so that it is connected electrically to said upper-surface electrode layers, a protective layer formed to cover at least the resistor layer and side-face electrode layers provided respectively on side faces of said substrate so that the side-face electrode layers are overlapping on part of upper surface of said upper-surface electrode layers for electrical connection. The above construction reduces the dispersion in measuring the resistance even if contact positions of the probes for the resistance measurement vary.

Resistor and method of manufacturing the same

A resistor for use in high density printed circuit board, having low current noise and improved resistance accuracy, and a method of manufacturing the resistor. A resistor of the present invention includes a substrate, a pair of upper-surface electrode layers formed on the end sections of the upper surface of said substrate, a resistor layer formed so that the layer is connected electrically to said upper-surface electrode layers, a first trimming groove formed by cutting said resistor layer, a resistance restoring layer which is formed to cover at least said first trimming groove, a second trimming groove formed by cutting the resistance layer and resistance restoring layer, and a protective layer provided to cover at least the resistance layer and second trimming groove. In this way, the resistors having a superior property in both the current noise characteristic and the resistance accuracy are obtained.

Resistor and method for manufacturing the same

A pair of upper electrode layers,, connected to resistor layer,, is formed with a gold system electro-conductive material containing glass frit on the side portion towards the edge of the upper surface of substrate,. The adhesive strength of which electrode layer to the substrate,is strong enough and the electrode layer withstands a thermal stress and a corrosive environment. A resistor thus manufactured maintains its superior electrical characteristics with a high operational reliability even in the harsh operating environment where there is a thermal amplitude lasting for a long term, in a corrosive atmosphere, etc.

The present invention is to offer a resistor which can be mounted exactly on the terminals disposed on a circuit board regardless the sides of the resistor, and to offer its manufacturing method by forming the surface of the side-electrode layer at a height higher than the surface of protection layer, or by forming the surface of the second surface electrode layer at a height higher than the surface of protection layer. By these, the resistor can be mounted exactly on the terminal of circuit board at a high yield. Furthermore, since the first surface electrode layer and the second upper electrode layer are electrically connected together through a window provided on the protection layer, a higher connection reliability can be obtained.

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Fukui, Japan

Shogo Nakayama