Kabushiki Kaisha Nihon Micronics

Shogo Mizutani

Hiroshi Kamiya

Yoshiyuki Fukami

Shou Harako

Noboru Otabe

Tatsuya Itoh

An electrical connecting apparatus according to the present disclosure is characterized in including a first electrode region in which a liquid metal is filled in a first recessed part that is capable of conducting with a substrate electrode of a first wiring substrate, a second electrode region in which a liquid metal is filled in a second recessed part that is capable of conducting with a substrate electrode of a second wiring substrate opposing the first wiring substrate in a vertical direction, and a connector that causes conduction between the first electrode region and the second electrode region by bringing one end part into contact with the liquid metal of the first electrode region and bringing the other end part into contact with the liquid metal of the second electrode region.

Electrical connecting apparatus

The present invention heightens positional accuracy of a plurality of conductive paths provided in a resilient connecting board and having connected thereto a plurality of probes. An electrical connecting apparatus includes a connecting board and a plurality of probes arranged on a lower side of the connecting board. The connecting board includes a first board having resiliency, a first sheet-like member arranged on a lower side of the first board, and a plurality of conductive paths passing through the first sheet-like member in an up-down direction. The probes are connected to lower ends of the conductive paths. The first sheet-like member is made of a photosensitive resin.

Growing community of inventors

Aomori, Japan

Shogo Mizutani