Seiko Epson Corporation

Shogo Inaba

Akira Sato

Toru Watanabe

Takeshi Mori

Ryuji Kihara

Satoru Tanaka

Akinori Yamada

Shigekazu Takagi

Aritsugu Yajima

Kyo Horie

Atsuki Naruse

Tomokazu Umeno

Yoko Kanemoto

A structure forming method according to an aspect is a structure forming method for forming a first hole and a second hole having width smaller than width of the first hole in a substrate with dry etching and forming a structure. The structure forming method includes forming an etching mask on the substrate, etching a portion of the etching mask overlapping a first hole forming region where the first hole is formed, etching a portion of the etching mask overlapping a second hole forming region where the second hole is formed, and performing the dry etching of the substrate using the etching mask as a mask.

Structure forming method and device

A physical quantity sensor includes a substrate, an element portion disposed so as to overlap the substrate, a conductor pattern disposed on the substrate so as to face the element portion, and a protection film covering at least a part of an exposed portion of the conductor pattern exposed from element portion in a plan view from a direction in which the substrate and the element portion overlap.

Physical quantity sensor, inertia measurement device, vehicle positioning device, portable electronic apparatus, electronic apparatus, and vehicle

A sensor includes a flexible wafer substrate and an oscillator provided on a principal surface of the wafer substrate, and the oscillator deforms when an external force is applied to the wafer substrate.

Sensor, electronic apparatus, robot, and mobile object

An MEMS vibrator includes a substrate, a fixation section disposed above a principal surface of the substrate, a support section extending from the fixation section, and a vibrating body (an upper electrode) separated from the substrate and supported by the support section in a node part of a vibration, and the vibrating body is a 2n-fold rotationally symmetric body having 2n beams radially extending from a node part of a vibration, wherein n is a natural number.

Vibrator, oscillator, electronic apparatus, moving object, and method of manufacturing vibrator

An electronic device according to the invention includes: a substrate; an MEMS structure formed above the substrate; and a covering structure defining a cavity in which the MEMS structure is arranged, wherein the covering structure has a first covering layer covering from above the cavity and having a through-hole in communication with the cavity and a second covering layer formed above the first covering layer and closing the through-hole, the first covering layer has a first region located above at least the MEMS structure and a second region located around the first region, the first covering layer is thinner in the first region than in the second region, and a distance between the substrate and the first covering layer in the first region is longer than a distance between the substrate and the first covering layer in the second region.

Electronic device covered by multiple layers and method for manufacturing electronic device

A MEMS vibrator includes: a substrate; a first electrode disposed above the substrate; and a second electrode disposed in a state where at least one portion of the second electrode has a space between the first electrode and the second electrode, and having a beam portion capable of vibrating, in the thickness direction of the substrate, with electrostatic force and a supporting portion supporting one edge of the beam portion and disposed above the substrate, wherein a supporting side face of the supporting portion supporting the one edge has a bending portion which bends in plan view from the thickness direction of the substrate, and the one edge is supported by the supporting side face including the bending portion.

MEMS vibrator and oscillator

A functional device includes: a substrate; a functional structure formed on the substrate; a cavity in which the functional structure is disposed; and a cover which covers the cavity, wherein the cover includes a bumpy structure including rib shaped portions, or groove shaped portions, which cross a covering range covering at least the cavity.

Functional device with functional structure of a microelectromechanical system disposed in a cavity of a substrate, and manufacturing method thereof

A micro electro mechanical system (MEMS) device includes: a fixed electrode made of silicon and provided above a semiconductor substrate; a movable electrode made of silicon and arranged in a mechanically movable manner by having a gap from the semiconductor substrate; and a wiring layered part that is provided around the movable electrode, covers a portion of the fixed electrode and includes wiring. One of the fixed electrode and the movable electrode is implanted with an impurity ion and at least a part of the portion of the fixed electrode covered by the wiring layered part is silicidized.

MEMS device and fabrication method thereof

A MEMS device includes a substrate, an insulating layer section formed above the substrate and having a cavity, a functional element contained in the cavity, and a fuse element contained in the cavity and electrically connected with the functional element. It is preferable that the fuse element is spaced apart from the substrate.

MEMS device

A MEMS device includes a substrate, a cavity formed above the substrate, a first vibrator contained in the cavity, and a second vibrator contained in the cavity and having a natural frequency different from that of the first vibrator. The first vibrator and the second vibrator are preferably arranged along a long side of the cavity having a rectangular shape in plan view.

MEMS device and oscillator

An electronic device, including a substrate, a functional structure constituting a functional element formed on the substrate, and a cover structure forming a cavity portion in which the functional structure is disposed, is disclosed. In the electronic device, the cover structure includes a laminated structure of an interlayer insulating film and a wiring layer, the laminated structure being formed on the substrate in such a way that it surrounds the cavity portion, and the cover structure has an upside cover portion covering the cavity portion from above, the upside cover portion being formed with part of the wiring layer that is disposed above the functional structure.

Electronic device and method for manufacturing thereof

A microelectromechanical system (MEMS) device includes a semiconductor substrate, a MEMS including a fixed electrode and a movable electrode formed on the semiconductor substrate through an insulating layer, and a well formed in the semiconductor substrate below the fixed electrode. The well is one of an n-type well and a p-type well. The p-type well applies a positive voltage to the fixed electrode while the n-type well applies a negative voltage to the fixed electrode.

MEMS device having a movable electrode

A resonator with a microeletromechanical system structure has a transistor with a gate electrode, a capacitor with an upper and lower electrode, a substrate, a first and second structure of the microelectromechanical system structure, a first silicon layer of the first structure and the upper electrode formed above the substrate, a second silicon layer of the second structure and the gate electrode unit formed above the substrate, and an insulating film formed above the capacitor and the transistor, the insulating film having an opening for placement of the second structure.

Resonator including a microelectromechanical system structure with first and second structures of silicon layers

An oscillator includes: a plurality of MEMS vibrators formed on a substrate; and an oscillator configuration circuit connected to the plurality of MEMS vibrators, wherein the plurality of MEMS vibrators each have a beam structure, and the respective beam structures are different, whereby their resonant frequencies are different.

MEMS oscillator and method of manufacturing thereof

A micro-electro-mechanical-system resonator, includes: a substrate; a fixed electrode formed on the substrate; and a movable electrode, arranged facing the fixed electrode and driven by an electrostatic attracting force or an electrostatic repulsion force that acts on a gap between the fixed electrode and the movable electrode. An internal surface of a support beam of the movable electrode facing the fixed electrode has an inclined surface.

Growing community of inventors

Shiojiri, Japan

Shogo Inaba