Shin-Etsu Handotai Co., Ltd.

Shogo Furuya

Junya Ishizaki

Tomohiro Akiyama

The present invention is a method for producing an electronic device having a drive circuit including a solar cell structure, the method including the steps of: obtaining a bonded wafer by bonding a first wafer having a plurality of independent solar cell structures including a compound semiconductor, the solar cell structures being formed on a starting substrate by epitaxial growth, and a second wafer having a plurality of independent drive circuits formed, so that the plurality of solar cell structures and the plurality of drive circuits are respectively superimposed; wiring the bonded wafer so that electric power can be supplied from the plurality of solar cell structures to the plurality of drive circuits respectively; and producing an electronic device having the drive circuit including the solar cell structure by dicing the bonded wafer. This provides a method for producing an electronic device including a drive circuit and a solar cell structure in one chip and having a suppressed production cost.

Method for producing electronic device comprising solar cell structure along with drive circuit

A light-emitting device including a window layer-cum-support substrate, a light-emitting portion provided on the window layer-cum-support substrate and including a second semiconductor layer of a second conductivity type, an active layer, and first semiconductor layer of a first conductivity type in stated order, a first ohmic electrode provided on the first semiconductor layer, and insulator top coat at least partially coating the first semiconductor layer surface and light-emitting portion side surface, wherein the first semiconductor layer surface and surface of the window layer-cum-support substrate are roughened, and the first semiconductor layer includes at least two layers of an active-layer-side layer and roughened-side layer, and roughened-side layer is formed of material having lower Al content than the active-layer-side layer. This light-emitting device can reduce etching depth required to obtain desired roughened shape and inhibit occurrence of chip cracks during wire bonding, while keeping effect of trapping carriers in the clad layer.

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Takasaki, Japan

Shogo Furuya