Kaneka Corporation

Shogo Fujimoto

Hisayasu Kaneshiro

Takashi Kikuchi

Masayoshi Shimizu

An object of this invention is to provide a polyimide film suitable for use in flexible printed circuit boards and the like which have high flexibility and dimensional stability, and to provide a laminate and metal-clad laminate which uses such a polyimide film. This invention relates to a multilayer polyimide film being a polyimide film having a multilayer structure, including: a core layer; and clad layers provided on each side of the film, which clad layers are exposed, the core layer being a non-thermoplastic polyimide having an average coefficient of linear expansion at a temperature from 100&#xb0; C. to 200&#xb0; C. in a range of 5 ppm/&#xb0; C. to 20 ppm/&#xb0; C., each of the clad layers being a polyimide having a peeling strength of 3 N/cm or less, the film as a whole having an average coefficient of linear expansion at a temperature range of 100&#xb0; C. to 200&#xb0; C. in a range of 9 ppm/&#xb0; C. to 30 ppm/&#xb0; C., and (a)&#x3e;(b), where (a) is an average modulus of elasticity of the core layer and (b) is an average modulus of elasticity of the clad layers.

Multilayer polyimide film, laminate, and metal-clad laminate

A metal-coated polyimide film is excellent in long-term adhesion reliability, exhibits various dimensional stabilities, and is particularly suitable for FPC, COF and TAB applications. The metal-coated polyimide film comprises a non-thermoplastic polyimide film; and a metal layer being directly formed on one surface or both surfaces of the non-thermoplastic polyimide film without using an adhesive, wherein the non-thermoplastic polyimide film contains a non-thermoplastic polyimide resin having a thermoplastic polyimide block component.

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Otsu, Japan

Shogo Fujimoto