Omron Corporation

Stmicroelectronics S.r.l.

Shobu Sato

Takashi Kasai

Sebastiano Conti

Yuki Uchida

Igino Padovani

Filippo David

Luca Molinari

Tomonori Seki

Martino Zerbini

Minoru Sakata

Mitsuru Fujii

Provided is an acoustic transducer including: a semiconductor substrate; a vibrating membrane, provided above the semiconductor substrate, including a vibrating electrode; and a fixed membrane, provided above the semiconductor substrate, including a fixed electrode, the acoustic transducer detecting a sound wave according to changes in capacitances between the vibrating electrode and the fixed electrode, converting the sound wave into electrical signals, and outputting the electrical signals. At least one of the vibrating electrode and the fixed electrode is divided into a plurality of divided electrodes, and the plurality of divided electrodes outputting the electrical signals.

Acoustic transducer and microphone using the acoustic transducer

Provided is an acoustic transducer including: a semiconductor substrate; a vibrating membrane provided above the semiconductor substrate, including a vibrating electrode; and a fixed membrane provided above the semiconductor substrate, including a fixed electrode, the acoustic transducer detecting a sound wave according to changes in capacitances between the vibrating electrode and the fixed electrode, converting the sound wave into electrical signals, and outputting the electrical signals. At least one of the vibrating electrode and the fixed electrode is divided into a plurality of divided electrodes, and the plurality of divided electrodes outputting the electrical signals.

Acoustic transducer

The present disclosure is directed to an acoustic transducer configured to detect a sound wave according to changes in capacitances between a vibrating electrode and a fixed electrode. At least one of the vibrating electrode and the fixed electrode being divided into a plurality of divided electrodes, and the plurality of divided electrodes outputting electrical signals. The disclosure includes a digital interface circuit coupled to the divided electrodes. The circuit includes a recombination stage, which supplies a mixed signal by combining the first digital processed signal and the second digital processed signal with a respective weight that is a function of a first level value of the first processed signal. An output stage is included, which supplies, selectively and alternatively, a first processed signal, a second processed signal, or a mixed signal.

Acoustic transducer and interface circuit

Fixed contacts ( A, A) are provided on the upper surface of a silicon substrate ( ). Signal lines ( ) electrically continuous with the fixed contacts ( A, A) are provided so as to pass through a silicon substrate ( ) from the obverse surface to the reverse surface thereof. Bumps ( ) electrically continuous with the signal lines ( ) are provided on the reverse surface of the silicon substrate ( ). A fixed electrode ( ) is provided on both sides of the fixed contacts ( A, A). Wiring conductors ( ) electrically continuous with the fixed electrode ( ) are provided so as to pass through the silicon substrate ( ) from the obverse surface to the reverse surface thereof. Bumps ( ) electrically continuous with the wiring conductors ( ) are provided on the reverse surface of the silicon substrate ( ). Through holes ( ) of the silicon substrate ( ) through which the signal lines ( ) are passed and through holes ( ) of the silicon substrate ( ) through which the wiring conductors ( ) are passed are hermetically sealed by a movable substrate ( ) or a cap ( ).

Static relay and communication device using static relay

Growing community of inventors

Ikoma, Japan

Shobu Sato