Globalfoundries Inc.

Sun Microsystems, Inc.

Shobhit Malik

Sriram Madhavan

Uwe Paul Schroeder

Piyush Pathak

Vikrant Kumar Chauhan

Swamy Muddu

Jaime Bravo

Thomas Herrmann

Eric Chiu

Hsiu-Nien Chen

Bob Yu

Shikha Somani

Wai Kit Leong

Stefan Schüler

Methodologies and a device for assessing integrated circuit and pattern for yield risk based on 3D simulation of semiconductor patterns are provided. Embodiments include generating, with a processor, a 3D simulation of semiconductor patterns; obtaining critical dimensions of distances between layers or within a layer of the 3D simulation of semiconductor patterns; comparing the set of critical dimensions with predefined minimum dimensions; and yield scoring each of the semiconductor patterns of the 3D simulation based on the comparing step.

Three-dimensional pattern risk scoring

A method and apparatus for selecting Si wafer WP based on individual or multiple DFM decks for Si-feed-forward and Si-feed-back analysis are provided. Embodiments include generating markers for a wafer from an individual DFM deck; generating UCF Indexes; determining whether a representative marker corresponding to a UCF is a candidate for WP prediction; extracting markers corresponding to that UCF-Index (UEF data) from a candidate; performing a UCF-Index-based sampling on the extracted UEF data set if a number of markers in the extracted UEF data set is larger than an inspection requirement; adding a location of each marker or group of markers in the extracted UEF data set to a sitelist after the UCF-Index-based sampling; sending the sitelist to a foundry for metrology analysis on sitelist locations; and adding the sitelist locations and corresponding UCF Index and metrology parameters to a design analysis database for analyzing other wafers/UCF Indexes.

Feed-forward for silicon inspections (DFM2CFM : design to silicon) and feed-back for weakpoint predictor decks (CFM2DFM : silicon to design) guided by marker classification, sampling, and higher dimensional analysis

An approach is provided for applying post graphic data system (GDS) stream enhancements back to the design stage. Embodiments include receiving a data stream of an integrated circuit design layout from a design stage, determining one or more design constructs based on an analysis of the data stream, determining one or more instructions to implement the one or more design constructs at the design stage, and sending the instructions to the design stage to implement the one or more design constructs.

Method and apparatus for applying post graphic data system stream enhancements

A method includes receiving a design layout file for an integrated circuit device in a computing apparatus. The design layout file specifies dimensions of a plurality of features. Outer markers are generated in the computing apparatus for at least a subset of the features based on the proximity of the features to one another and spacing requirements. Features are identified in the computing apparatus where the associated outer marker has at least one dimension greater than the dimensions specified for the feature.

Pattern based method for identifying design for manufacturing improvement in a semiconductor device

A method and apparatus for enforcing design for manufacturability rules on a circuit layout is provided. A tool receives a first set of design rules, to be applied to the circuit layout, which must be followed. The tool also receives a second set of design rules, to be to the circuit layout, which may be followed. The first set of design rules may be supplied by an employer or followed by a design team, and the second set of design rules may correspond to a set of design for manufacturability (DFM) rules. The tool applies the first set of design rules and the second set of design rules to the circuit layout to generate a revised circuit layout. The revised circuit layout conforms to each of the first set of design rules, and conforms to as many design rules in the second set of design rules as possible.

Systematic approach for applying recommended rules on a circuit layout

One embodiment of the present invention provides a system that migrates a layout of a cell which is used in integrated circuit design. During operation, the system receives a layout for the cell, wherein one or more layers of the cell contain tracks for metal wires. The system then determines how many tracks are to be inserted into the cell. Next, the system inserts one or more extra tracks between the tracks in the cell. The system subsequently adjusts the widths of the inserted tracks and the original tracks to increase the total number of tracks within the cell while maintaining the metal wires at the center of their original tracks.

Growing community of inventors

Sunnyvale, CA, United States of America

Shobhit Malik