Fuji Electric Co., Ltd.

Sho Takano

Hidetoshi Umida

Hiroto Watanabe

A bus bar includes a laminated body formed by directly laminating a flat plate-shaped first conductive plate, flat plate-shaped insulating sheet, and flat plate-shaped second conductive plate. The laminated body has main terminal connection parts into which end portions of external connection terminals are inserted, and is sealed in a sealing body, except the main terminal connection parts. The first conductive plate, insulating sheet, and second conductive plate are pressurized toward the insulating sheet in the lamination direction of the laminated body so that volumes of air spaces inside the insulating sheet (and air spaces between the first conductive plate and the insulating sheet and between the second conductive plate and the insulating sheet) are compressed.

Semiconductor device and method of manufacturing the same

Provided is a semiconductor device including: a laminated substrate in which a circuit layer, an insulating layer, and a metal layer are sequentially laminated. A slit is formed in the circuit layer. A recess recessed from one surface side facing the insulating layer toward the other surface side is formed in the metal layer. The recess of the metal layer has a relaxation portion at least partially overlapping the slit of the circuit layer in a planar view.

Semiconductor device, semiconductor module, vehicle, and manufacturing method of semiconductor device

A gate drive circuit includes a signal generation unit configured to generate a first gate drive signal, a signal isolation unit configured to produce, at an output side thereof in response to the first gate drive signal, a second gate drive signal electrically isolated from the signal generation unit, an output stage device configured to receive the second gate drive signal at an input side thereof and to produce a third gate drive signal at an output side thereof in response to the second gate drive signal, a first path connecting the output side of the signal isolation unit and the input side of the output stage device; and a second path connecting the output side of the signal isolation unit and the output side of the output stage device.

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Tokyo, Japan

Sho Takano