Murata Manufacturing Co., Ltd.

Sho Suzuki

Kengo Onaka

Keisei Takayama

Saneaki Ariumi

Makoto Takeoka

Tomoshige Furuhi

Hideyuki Taguchi

Shun Sakaida

Shigeyuki Kamio

An antenna module includes a dielectric substrate and a radiating element disposed on the dielectric substrate. The dielectric substrate includes first and second flat portions with different normal directions, and a bending portion that connects the first flat portion and the second flat portion. The bending portion has a bending region having a curvature. The first and second flat portions have a straight region having no curvature. The radiating element is disposed in the first flat portion. In a Raman spectrum obtained by Raman scattering spectroscopic analysis of a cross section of the dielectric substrate, a wave number difference indicating a difference between a wave number which is a mode value in the straight region and a wave number which is a mode value in the bending region is 0.1 cmor more.

Antenna module and communication device mounting same, dielectric substrate, and manufacturing method of antenna module

A component includes a main member that includes a first surface that opposes a circuit board, the component being mounted to the circuit board during an assembly procedure, and a plurality of legs that protrude from the first surface, the plurality of legs having ends, wherein the component is mounted on the circuit board with the ends of the plurality of legs fixed to the circuit board, each of the ends of the plurality of legs includes an end surface that opposes the circuit board at time of the assembly procedure, and also includes a bevel that is continuous with the end surface and inclined with respect to the end surface, and an interior angle formed between the end surface and the bevel is larger than or equal to 120&#xb0; and smaller than or equal to 170&#xb0;.

Component mounted on circuit board

The insertion loss of a multilayer substrate and an antenna element is reduced. A multilayer substrate according to an embodiment of the present disclosure includes a multilayer body, a wire conductor, and a first ground electrode. The multilayer body is formed by dielectric layers being layered. The wire conductor is formed in the multilayer body, and a radio frequency signal passes through the wire conductor. The first ground electrode is formed in or on the multilayer body and includes a first surface that faces the wire conductor. The first surface includes a first region and a second region. The surface roughness of the first region is lower than the surface roughness of the second region. The first region overlaps at least part of the wire conductor in plan view in a direction normal to the first ground electrode.

Multilayer substrate and antenna element

A transmission line () includes a multilayer substrate (), a signal pattern line (), a ground pattern conductor (), and an intermediate ground pattern conductor () that is arranged between the signal pattern line () and the ground pattern conductor () and that is electrically connected to the ground pattern conductor (). The signal pattern line () has a first connection point () to which a signal conductor extending in a laminating direction of the multilayer substrate () is connected. A first cavity portion () is formed in the intermediate ground pattern conductor () at a position overlapped with a first end portion () of the signal pattern line () in a plan view of the multilayer substrate (). A first end edge () of the first cavity portion () has a first overlapping portion () overlapped with the signal pattern line ().

Growing community of inventors

Kyoto, Japan

Sho Suzuki