Omron Corporation

Sho Sasaki

Junichi Tanaka

Yoshitaka Adachi

Atsushi Hashimoto

Fumiji Aita

Masao Shimizu

Hiroyuki Miyaura

Shinichi Hosomi

Takeshi Fujiwara

Makoto Ohhira

Ryoji Shimizu

Takaaki Miyaji

Muneharu Miyakoshi

Akinobu Kanai

Yutaka Koyama

A cultivation and management device for fruit vegetable plants and fruit trees includes environment state information on an environment state of a fruit vegetable plant or a fruit tree to be cultivated, planned cultivation evaluation index information on a preplanned cultivation evaluation index of the fruit vegetable plant or the fruit tree, a calculation unit configured to determine and output a work including a shape change work for the fruit vegetable plant or the fruit tree with respect to inputs of the environment state information and the planned cultivation evaluation index information with a learning model, and an output unit configured to output the work including the shape change work for the fruit vegetable plant or the fruit tree.

Management device for cultivation of fruit vegetable plants and fruit trees, learning device, management method for cultivation of fruit vegetable plants and fruit trees, learning model generation method, management program for cultivation of fruit vegetable plants and fruit trees, and learning model generation program

A plant biosensor includes a solar radiation sensor that measures a solar radiation amount with which the plant is irradiated, a sap flow sensor that measures a flow rate of sap flowing in a body of the plant, and an absorbed nutrient sensor that measures a nutritional state of the plant.

Plant biosensor

A sensor package has a semiconductor sensor chip, and a package body that has a semiconductor sensor chip mounting region on which the semiconductor sensor chip is mounted. The package body being a resin injection molded product. A groove is formed in a rear surface on an opposite side to a surface, on which the semiconductor sensor chip is mounted, so as to surround the semiconductor sensor chip mounting region. A coupling section is formed in the rear surface to couple a resin portion inside the groove and a resin portion outside the groove.

Sensor package

The present invention provides an infrared sensor and an infrared sensor module having reduced noise, improved detection precision, and reduced manufacture cost. The infrared sensor includes a first substrate transmitting infrared light including at least one reduced-pressure and sealed cavity, at least one infrared sensing unit provided on the side of the first substrate, and at least one infrared sensing unit generating an output change. The infrared sensor includes a second substrate stacked on the first substrate with a recess, a reflection face capable of reflecting the infrared light, and at least one arithmetic circuit for amplifying or integrating an output, arranged in such a manner that the reflection face is sandwiched between the at least one sensing unit and the least one arithmetic circuit.

Infrared sensor and infrared sensor module

A flow sensor and a flow rate measuring method are disclosed, in which an error caused by dust attached to the flow sensor is accurately corrected taking advantage of the fact that the output characteristic of the flow sensor representing the relation between the temperature measured by a temperature measuring unit and the flow rate of the fluid undergoes a change with the dust attached. The flow sensor includes a thin-film bridge unit formed on a substrate, a heater arranged on the bridge unit, and a temperature measuring unit arranged on the bridge unit.

Flow sensor and flow rate measuring method

Growing community of inventors

Kyoto, Japan

Sho Sasaki