Tdk Corporation

Sho Nakagomi

Tomokazu Ito

Makoto Yoshida

Tomonaga Nishikawa

Takeshi Okumura

Hiroshi Kamiyama

Atsushi Hitomi

Kensaku Asakura

Yasuhiro Hirobe

Masao Asakawa

Tatsuya Karakame

A coil componentis provided with a substrate, a thin-film coil layerprovided on the substrate, first and second bump electrodesprovided on a surface of the thin-film coil layer, a first lead conductorprovided on the surface of the thin-film coil layertogether with the first and second bump electrodesand formed integrally with the first bump electrode, and an insulator layerprovided between the first bump electrodeand the second bump electrode. The thin-film coil layercontains a first spiral conductorwhich is a plane coil pattern. The first bump electrodeis connected to an internal peripheral end of the first spiral conductorvia the first lead conductor. The second bump electrodeis connected to an external peripheral end of the first spiral conductor

Coil component and method of manufacturing the same

The present invention is provided with a composite electronic device comprising an inductor element and an ESD protection element formed between two magnetic substrates, wherein the inductor element includes insulation layers made of a resin, and spiral conductors formed on the insulation layers, the ESD protection element includes a base insulation layer, a pair of gap electrodes arranged via gap formed therebetween on the base insulation layer, and an ESD absorbing layer arranged at least between the gap electrodes, and the ESD absorbing layer includes a composite material having an insulation inorganic material and a conductive inorganic material discontinuously dispersed in a matrix of the insulation inorganic material. The gap of the ESD protection element is provided at exterior of the spiral conductor so as not to be overlapped with the spiral conductor in view of a laminating direction.

Composite electronic device

A common mode filter is provided as one in a three-layered structure with improved high-frequency characteristics. The common mode filterhas the three-layered structure including a first coil layera second coil layerand a lead layerA first planar coiland a second planar coilof a substantially circular spiral shape are formed in the first and second coil layersrespectively. A first lead wireand a second lead wireformed in a lead layerhave a first straight portionc and a second straight portionc, respectively. The first straight portionc is located on a straight line Lperpendicular to a plurality of first tangent lines to spiralsat a plurality of respective intersection points with the spirals. The second straight portionc is located on a straight line Lperpendicular to a plurality of second tangent lines to the spiralsat a plurality of respective intersection points with the spirals

Common mode filter

Growing community of inventors

Tokyo, Japan

Sho Nakagomi