Tdk Corporation

Tdk Electronics Company, Limited

Tokyo Denki Kagaku Kogyo Kabushiki Kaisha

Tdk Kabushiki Kaisha

Sho Masujima

Hiroshi Yagi

Toshihiko Miyajima

Shoichi Iwaya

Hideaki Watanabe

Eisaku Miyauchi

Atsuzo Tamashima

Hisao Abe

Masakazu Kamoshida

Yasunobu Oikawa

Hitoshi Masumura

Shinobu Fujiwara

Nobuaki Kikuchi

Norimasa Sakamoto

Yoshishige Towatari

Jun Tamashima

Yoshifumi Midori

Kenichi Umeda

Iwaya Shoichi

Masahide Shibuya

Yamamoto Yoshihito

A clean transfer method and an apparatus therefor capable of receiving, storing and transferring a transferred object by means of a vacuum clean box while eliminating arrangement of any vacuum evacuation means and transfer means in the vacuum clean box, as well as facilitating connection of the vacuum clean box to various processing units. The vacuum clean box is free of any vacuum evacuation means and transfer means and is provided with a first opening selectively closed with a first shutter and kept airtight when the first opening is closed with the first shutter. The vacuum clean box is airtightly connected to a sputter unit which is provided with a second opening selectively closed with a second shutter, when the first and second openings are closed with the first and second shutters, respectively, resulting in forming a closed space therebetween through which the first and second shutters are opposite to each other. Then, the first and second openings are released from the first and second shutters to permit the vacuum clean box and sputter unit to communicate with each other.

Clean transfer method and apparatus therefor

A clean transfer method and an apparatus therefor capable of facilitating storage and transfer of transferred objects by a vacuum clean box and realizing transfer of the objects to various processing units other than a vacuum unit. A vacuum clean box and a clean unit are airtightly connected to each other. The vacuum clean box includes a first shutter acting also as a lid and arranged so as to airtightly close a first opening of the box. The clean unit is provided with a second opening selectively closed by a second shutter. Airtight connection between the vacuum clean box and the clean unit is carried out while keeping the first and second openings closed by the first and second shutters, respectively, to thereby form a closed space therebetween which the first and second shutters face. Then, the closed space is evacuated to a vacuum, followed by opening of only the first shutter. Subsequently, a clean atmosphere which is substantially identical with a clean atmosphere in the clean unit is formed in the closed space and the second shutter is opened to introduce the first and second shutters into the clean unit.

A carrier tape for electronic circuit elements adapted to be provisionally held on printed circuit boards prior to fixing of them on said printed circuit boards by soldering, comprises a flexible tape body extending in a longitudinal direction, and adhesive means applied with respect to the tape body and for serving the purpose of provisionally holding of electronic circuit elements on printed circuit boards, the adhesive means being formed of a material which exhibits adhesion upon being heated. The adhesive means is formed of a polymeric material which exhibits adhesion upon being heated. The carrier tape further includes electronic circuit elements held with respect to the tape body at equal intervals in a row in the longitudinal direction of the tape body through the adhesive means, thereby constituting an electronic circuit element series. When respective electronic circuit elements are removed from the electronic circuit element series, the adhesive means sticking to the respective electronic circuit elements are adapted to be also removed from the series. The adhesive means sticking to the respective electronic circuit elements are then heated, through which adhesive means have exhibited adhesion due to heating the respective electronic circuit elements are provisionally held on a printed circuit board. Also, a method of manufacturing an electronic circuit element series is disclosed.

Carrier tape for electronic circuit elements and method of manufacturing

An electronic circuit element capable of positively and stably accomplishing its provisional fixing on a printed circuit board substantially free of any trouble and being readily taken out or extracted for the mounting on a printed circuit board, irrespective of a manner of holding of the circuit element prior to the extraction. The electronic circuit element includes an element body and an adhesive or polymeric layer deposited on the element body. The polymeric layer is arranged on a surface of the element body opposite to a printed circuit board on which the circuit element is to be mounted. The polymeric layer is formed of a material exhibiting adhesion when it is heated to a temperature of about 80.degree. C.

Electronic circuit element

A method of mounting surface-mounted type electronic components on a printed circuit board adapted to be carried out using an electronic component series which comprises a carrier tape formed with a plurality of tiny recess portions for receiving therein adhesives for use in temporary fixing of surface-mounted type electronic components on a printed circuit board, adhesives received in the respective recess portions, and a plurality of surface-mounted type electronic components held on the carrier tape through the adhesives. In the present invention, the taking up of the electronic component from the carrier tape is performed while pushing up the tiny recess portion of the carrier tape to cause the same portion to be deformed, so that the electronic component can be easily removed together with the adhesive from the carrier tape, and the removed electronic component is then placed on a printed circuit board to be temporarily held on the printed circuit board through the adhesive having adhered on the bottom surface of the electronic component.

Method of mounting surface-mounted type electronic components on a

Current restriction element responsive to applied voltage

A D-E hysteresis loop of ferroelectrics known in the art has a square shape when the ferroelectrics are a BaTiO.sub.3 single crystal. Such ferroelectrics are used as a non-linear dielectric element of, for example a pulse generating device. The non-linear dielectric element according to the present invention consists of a polycrystal, which is mainly composed of BaTiO.sub.3 and has the chemical composition expressed by the formula A.sub.y B.sub.z O.sub.3, wherein the molar ratio of y/z ranges from 0.92 to 0.99. The non-linearity is excellent and the temperature dependence of the A.sub.y B.sub.z O.sub.3 composition is considerably low.

Non-linear dielectric element

A capacitor trimming system for a quartz-crystal oscillator in a watch and/or a clock for providing a punctual watch and/or a clock has been found. The system comprises an oscillation circuit including at least a quartz-crystal piece, a trimmer capacitor for adjusting the oscillating frequency of the quartz-crystal piece, a semiconductor electronic circuit for operating said quartz-crystal piece, and apparatus for adjusting automatically the trimmer capacitor so that the oscillating frequency becomes the same as the desired reference frequency. The trimmer capacitor comprises of at least a fixed outer trimming electrode, an inner common electrode fixed parallel to said trimming electrode and a dielectric body sandwiched between the two electrodes. The trimming electrode is disposed in the air for enabling the trimming of the area of the trimming electrode, and the trimming electrode has a coarse adjustment portion parallel and aligned with said common electrode and a fine adjustment portion attached to the same plane of that of the coarse adjustment portion but outside of the common electrode. The oscillation frequency of the quartz-crystal piece is automatically picked up and the frequency is compared with the desired reference frequency, and according to the result of the comparison, the trimming electrode is trimmed so that the oscillating frequency becomes the desired reference frequency. The trimming is carried out first for the coarse trimming portion, and secondly for the fine adjustment portion.

Capacitor trimming system in a quartz-crystal oscillator

A chip capacitor which has a substantially rectangular dielectric body having a pair of long sides, a pair of short sides perpendicular to said long sides, a pair of conductive confronting electrodes attached on the surface of the dielectric body so that the electrodes sandwich the dielectric body, a pair of terminals each provided along the related short side of the dielectric body and being electrically connected to the related electrode, and the junction point of each long side and each short side of the dielectric body is recessed. Preferably, the dielectric body is tapered towards the short sides.

Chip ceramic capacitor

In an apparatus and process for transport and support of electronic components, the leads of the components are mounted transversely and parallel to each other on a support strip adapted for being moved in a longitudinal direction. The leads are mounted so that they are parallel to each other and equidistant and held firmly in position by adhesive tape of specified thickness in relation to the thickness of the support strip. The leads protrude from at least one edge of the support strip to facilitate attachment of electronic components. Positive positioning of the leads at accurately spaced distances is achieved.

Growing community of inventors

Tokyo, Japan

Sho Masujima