Anokiwave, Inc.

M/a -Com, Inc.

Shmuel Ravid

Robert Ian Gresham

Kristian N Madsen

David W Corman

Nitin Jain

Robert J McMorrow

Vipul Jain

Gaurav Menon

Jonathan P Comeau

Tissana T Kijsanayotin

Alan R Olsen

Gary E St Onge

A conditioning integrated circuit (CDIC) chip can be used to aggregate signals to/from a number of beam forming integrated circuit (BFIC) chips, and signals to/from a number of CDIC chips can be aggregated by an interface integrated circuit (IFIC) chip. The CDIC chip includes temperature compensation circuitry to adjust the gain of the transmit and receive signals as a function of temperature based on inputs from a temperature sensor. The CDIC may include a plurality of beam forming channels each having a transmit circuit and a receive circuit, a common port coupled to the beam forming channels for selectively providing a common transmit signal to the beam forming channels and receiving a common receive signal from the beam forming channels, and a temperature compensation circuit configured to provide variable attenuation to the common transmit signal and the common receive signal based on a temperature sense signal.

Phased array architecture with distributed temperature compensation and integrated up/down conversion

Exemplary embodiments dynamically select the LO frequency and mixer mode (i.e., low-side LO injection or high-side LO injection) for upconversion based on the desired RF output frequency in order to mitigate the effects of spurious and LO leakage signals that could violate radiation emission limits, e.g., in the case where the IF signal frequency is smaller than the RF operating band. By dynamically switching the LO frequency and mixer mode as a function of the requested operating RF channel, low-level emissions and spurious signal compliance with restricted bands can be achieved.

Spur mitigation in a heterodyne upconversion system

An electronic attenuator device is provided whose attenuation characteristics are substantially insensitive to variations in component element parameters and ambient temperature changes. Advantageously, an attenuator device made according to the present invention may be constructed at substantially reduced cost without loss of attenuation precision.

Electronic attenuator

Growing community of inventors

Newton, MA, United States of America

Shmuel Ravid