Mellanox Technologies, Ltd.

Shmuel Levy

Shai Rephaeli

Shai Cohen

Yonatan Malkiman

Evelyn Landman

Nimer Khazen

Eyal Moshe Waldman

Elad Mentovich

Benny Koren

Sylvie Rockman

Rafi Lagziel

Eyal Babish

Ronnen Lovinger

A method includes defining a target performance for a communication network that includes multiple network nodes interconnected by Active Optical Cables (AOCs). Respective parameters, which cause the communication network to achieve the target performance, are selected for the AOCs. Commands are sent to the AOCs to set the selected parameters.

Control of communication network performance by varying active optical cable parameters

An apparatus includes an array of electro-optical transducers, control circuitry, and a connector housing. The electro-optical transducers are configured to convert between electrical signals and respective optical signals conveyed over respective optical fibers. The control circuitry is configured, in response to a failure of a first electro-optical transducer in the array that is associated with a given optical fiber, to switch one or more of the electrical signals and the optical signals so as to replace the first electro-optical transducer with a second electro-optical transducer in the array in conveying an optical signal over the given optical fiber. The connector housing contains the array of the electro-optical transducers and the control circuitry.

High-reliability active optical cable (AOC) with redundant emitters

An apparatus includes a base substrate, a light rotation module and a flexible printed circuit board (PCB). The light rotation module has a bottom surface mounted on the base substrate and a top surface coupled to one or more optoelectronic transducers, and is configured to direct optical signals between the respective optoelectronic transducers and optical ports on a side perpendicular to the top surface. The flexible printed circuit board (PCB) includes a first end that is attached to the top surface of the light rotation module and has the optoelectronic transducers mounted thereon, a second end attached to the base substrate, and conductive traces disposed between the first and second ends to direct electrical signals between the optoelectronic transducers and the base substrate.

High-speed optical module with flexible printed circuit board

An apparatus includes a bank of optical detectors, an input optical filter and a selector. The optical detectors are configured to output respective detection indications in response to detecting a presence of an optical signal. The input optical filter is configured to receive an input optical signal having an input wavelength, and to route the input optical signal to one of the optical detectors in the bank depending on the input wavelength. The selector is configured to select an output wavelength based on the detection indications of the optical detectors, and to cause generation and transmission of an output optical signal at the selected output wavelength.

Wavelength auto-negotiation

A method for fabricating an optical interconnect includes producing a semiconductor wafer that includes multiple first dies. Each first die includes circuitry disposed over a surface of the wafer and connected to conductive vias arranged in rows. The multiple first dies are diced by cutting the wafer across the rows of the vias, such that, in each first die, the cut vias form respective contact pads on a side face of the first die that is perpendicular to the surface. A second semiconductor die including one or more optoelectronic transducers is attached to the contact pads, so as to connect the transducers to the circuitry.

Method of fabricating integrated optoelectronic interconnects with side mounted transducer

An apparatus includes a connector that connects to optical fibers for connecting first and second optical signals to the apparatus. A first optical ferrule is mounted perpendicularly to the connector, and transfers the first optical signals between the connector and first optical transducers mounted on a first substrate, via first holes formed in the first substrate. A second optical ferrule is mounted perpendicularly to the connector, and transfers the second optical signals between the connector and second optical transducers mounted on a second substrate, via second holes formed in the second substrate. A light rotation module bends and transfers the first and second optical signals between the connector and the first and second ferrules. One or more lenses are mounted between the first ferrule and the first holes, so as to couple the first optical signals via the first holes between the first ferrule and the first optical transducers.

Optical interface and splitter with micro-lens array

An optical interface module includes a single flexible Printed Circuit Board (PCB) including conductive traces. An electrical connector, one or more opto-electronic transducers and ancillary circuitry are disposed on the flexible PCB. The electrical connector is configured to mate with a corresponding connector on a substrate. The opto-electronic transducers are configured to be coupled to optical fibers carrying optical signals. The ancillary circuitry is coupled by the traces to the opto-electronic transducers and the electrical connector so as to convey electrical signals corresponding to the optical signals between the opto-electronic transducers and the electrical connector.

Optical module fabricated on folded printed circuit board

An apparatus includes an optically opaque substrate, which includes first and second opposite surfaces and has one or more openings traversing through the substrate between the first and second surfaces. One or more optical transducers are attached to the first surface of the substrate so as to emit or detect light via the respective openings. One or more lenses are positioned against the respective openings on the second surface of the substrate, and are configured to couple the light between the optical transducers and respective optical fibers.

Flip-chip optical interface with micro-lens array

A method for fabricating an integrated optical interconnect includes disposing a layer over a substrate on which at least one optoelectronic transducer has been formed. A groove is formed in the layer in alignment with the optoelectronic transducer. A slanted mirror is formed in the layer at an end of the groove adjacent to the optoelectronic transducer to direct light between the optoelectronic transducer and an optical fiber placed in the groove.

Integrated optical interconnect

An apparatus includes an optical Input/Output (I/O) connector, which has a central axis that is mounted in a plane and which is configured to connect to external optical fibers for transferring input optical signals to the apparatus and output optical signals from the apparatus. A first optical ferrule is mounted perpendicularly to the optical I/O connector in the plane, and is configured to transfer the input optical signals from the optical I/O connector to respective optical detectors. A second optical ferrule is mounted perpendicularly to the optical I/O connector in the plane, and is configured to transfer the output optical signals from respective optical emitters to the optical connector. A light rotation module is configured to bend and transfer the input and output optical signals between the optical I/O connector and the perpendicularly-mounted first and second optical ferrules.

Growing community of inventors

Kyriat Tivon, Israel

Shmuel Levy