Murata Manufacturing Co., Ltd.

Senju Metal Industry Co., Ltd.

Murata Mfg. Co., Ltd.

Shizuharu Watanabe

Hiromichi Kawakami

Michiaki Iha

Masahiro Kubota

Makoto Tose

Hiroji Tani

Hiroshi Takagi

Hidekiyo Takaoka

Mitsuhiro Kusano

Toshiki Tanaka

Koichi Hayashi

Tohru Kasanami

Kosuke Nakano

Hirofumi Sunahara

Keisuke Nagata

Toru Kasanami

Ko Inaba

Shodo Takei

Shigeharu Kasai

Koichi Ishida

Toshiaki Ikeda

Masafumi Seino

Shuji Mushimoto

A solder paste comprising a solder alloy powder and a flux. The volumetric expansion at the time of melting of the solder alloy is at most 0.5%. The flux contains a bisphenol A epoxy resin and a curing agent selected from a carboxylic anhydride and a dicarboxylic acid. The solder paste can be used in applications suitable for high-temperature solders. The solder alloy has an alloy composition comprising, in mass percent, 70-98% of Bi, a total of 0-0.5% of at least one substance selected from Ag, Cu, Sb, In, Zn, Ni, Cr, Fe, Mo, P, Ge, and Ga, and a remainder of Sn.

Lead-free solder paste and its use

The formation of a resistive electrode layer as a portion of an external electrode of a monolithic ceramic capacitor by baking a resistive paste, which contains ITO, a glass frit, and an organic vehicle, to impart the function of a resistance element to the external electrode may lead to the occurrence of blisters or reduced denseness. This is modulated when the resistive paste further contains a densification promoting metal or oxide, which promotes densification of a sintered compact of the resistive paste, and a densification preventing metal oxide, which prevents the densification.

Resistive paste and monolithic ceramic capacitor

A piezoelectric actuator includes external conductors formed on an outer surface of a piezoelectric component. The external conductors each include a thick-film conductor and a conductive reinforcer. The thick-film conductor is provided with a first thick-film conductor formed on the outer surface of the piezoelectric component, second thick-film conductors which are formed on part of an outer surface of the first thick-film conductor and which are in surface-contact with the outer surface of the first thick-film conductor. The conductive reinforcer is attached to outer surfaces of the second thick-film conductors.

Piezoelectric actuator

An external electrode structure for a monolithic ceramic capacitor provided with a function as a resistance element is capable of preventing a reduction of the external electrode due to baking in a reducing atmosphere, so that Ni or a Ni alloy can be used in an internal electrode and a good electrical connection between the internal electrode and the external electrode is achieved. The external electrodes disposed on an outer surface of a capacitor main body include an electrically conductive layer and a metal plating layer disposed thereon, and the electrically conductive layer includes a compound oxide, e.g., an In&#x2014;Sn compound oxide, which reacts with Ni or the Ni alloy, and a glass component.

Monolithic ceramic capacitor and method for adjusting equivalent series resistance thereof

A photosensitive thick film composition is provided which has superior storage stabilities and can be reliably processed by developing. The photosensitive thick film composition is composed of a photosensitive organic component containing an organic binder having an acidic functional group, such as a carboxyl group, an inorganic component containing a polyvalent metal oxide, such as borosilicate glass, and an alcohol having a plurality of hydroxyl group, such as glucitol.

Photosensitive thick film composition and electronic device using the same

Methods and apparatuses for efficiently forming a homogeneous glass layer having uniform thickness and a homogeneous metal layer having uniform thickness are provided. A workpiece is accommodated in a screened container which is rotatable in a predetermined direction. The workpiece in the container is sprayed with an atomized glass slurry or an atomized metal slurry while the container is rotated in order to form a green glass layer or a green metal layer on the workpiece. Simultaneously, hot air is supplied to the workpiece so as to dry the green glass layer or the green metal layer. Thus, the workpiece, typically a ferrite core, can be provided with a homogeneous layer having a uniform thickness. A method for manufacturing an electronic component using the above-described methods and apparatuses is also provided.

Method and apparatus for forming glass layer, method and apparatus for forming metal layer, and electronic component manufacturing method

A photosensitive insulating paste contains a borosilicate glass powder and a crystalline SiO powder, wherein the powders are dispersed in a photosensitive organic vehicle and the paste contains the crystalline SiO component in an amount of about 3-40 wt. % after sintering. A thick-film multi-layer circuit substrate (e.g., chip inductor) comprising an insulating substrate on which insulating layers are formed, wherein the insulating layers are formed through exposure, development and sintering, after the application of the photosensitive insulating paste.

Photosensitive insulating paste and thick film multi-layer circuit substrate

A crystallized glass composition contains a principal ingredient comprising SiO , MgO and Al O and contains about 2 to 20 parts by weight of B O relative to 100 parts by weight of the principal ingredient. In a ternary diagram, the weight ratio (SiO , MgO, Al O ) lies within a region surrounded by point A (44.0, 55.0, 1.0), point B (34.5, 64.5, 1.0), point C (35.0, 30.0, 35.0) and point D (44.5, 30.0, 25.5).

Crystallized glass composition, sintered crystallized glass compact, and circuit substrate using the same

A method for forming a conductive pattern includes: applying a photosensitive conductive paste to a support to thereby form a film which paste contains an organic binder having an acidic functional group, a photosensitive organic component, a multivalent metallic powder, and a mono-ol compound having a boiling point of about 178&deg; C. or more, an anion-adsorbing material and/or a thixotropic agent; exposing and developing the film to thereby form conductive patterns and and transferring the conductive patterns and which are formed on the support onto a ceramic green sheet The invention also discloses a method for producing a ceramic multi-layer substrate.

Method for forming conductive pattern and producing ceramic multi-layer substrate

A photosensitive insulating paste including an insulating material containing a borosilicate glass powder. The insulating material is dispersed in a photosensitive organic vehicle, and the borosilicate glass powder contains SiO , B O and K O such that the compositional proportions by weight of the three components represented by (SiO , B O , K O) fall within a region formed by connecting points A (65, 35, 0), B (65, 25, 10), C (85, 5, 10) and D (85, 15, 0) in a ternary diagram thereof. A thick-film multi-layer circuit substrate including the paste is also disclosed.

Photosensitive insulating paste and thick-film multi-layer circuit substrate

There is disclosed a paste composition comprising a mixture of: an organic binder having an acidic functional group; at least one polyvalent metal or a polyvalent metallic compound; and an anion-adsorptive substance having the property of adsorbing an anion of said organic binder. The paste composition is capable of inhibiting gelation in a mixture of an organic binder having an acidic functional group with a polyvalent metal or a polyvalent metallic compound and is excellent in storage stability.

Paste composition, green sheet, and multilayer substrate

Disclosed is an insulating glass paste capable of forming an over glaze layer having a low rate of occurrence of cracks and excellent reliability. The insulating glass paste is used for forming an over glaze layer on an insulating substrate exhibits a fracture toughness strength of about 1.0 MN/m or more after burning.

Insulating glass paste and thick-film circuit component

Provided is a crystalline glass composition for use in a circuit board that can be sintered at a temperature of 1100&deg; C. and is endowed with favorable characteristics such as a relative dielectric constant of as low as &frac12; and a thermal expansion coefficient of as high as 12 ppm/&deg; C. as an electrical insulating insulator for use in a circuit board. The crystalline glass composition contains SiO,, MgO and CaO, the composition ratio of SiO,, MgO and CaO in % by weight falling within an area surrounded by the lines connecting the points A (25, 45, 30), B (25, 0, 75), C (44, 0, 56), D (44, 22, 34), E (40, 19, 41) and F (29, 40, 31) in a ternary phase diagram wherein at least one melwinite, monticellite or calcium silicate crystalline phase is deposited by heat-treating the composition. A ceramic powder having a thermal expansion coefficient of about 6.0 ppm/C or more is sometimes added in the powder comprising the glass composition.

Crystalline glass composition for use in circuit board, sintered crystalline glass, insulator composition insulating paste and thick film circuit board

The invention provides an insulating paste, comprising: an organic vehicle containing an organic binder, a photo-polymerization initiator and a photosetting monomer; and a silicate glass powder having a softening point in a range of about 700&deg; C. to 1,050&deg; C. and having an average particle size in a range of about 0.1 to 5.0 &mgr;m, said silicate glass powder being dispersed into said organic vehicle. Preferably, the silicate glass powder of the above insulating paste comprises a composition represented by xSiO,-yB,O,-zK,O where x&plus;y&plus;z is 100 parts by weight and the values z, y and z are on lines or within a region enclosed by lines passing through four points A(65, 35, 0), B(65, 20, 15), C(85, 0, 15) and D(85, 15, 0) on a ternary diagram thereof.

Growing community of inventors

Omihachiman, Japan

Shizuharu Watanabe