Nec Corporation

Nec Access Technica, Ltd.

Nec Accesstechnia Ltd.

Shizuaki Masuda

Katsuhiko Suzuki

Takao Yamazaki

Shinji Watanabe

Nobuyuki Sato

Tomoo Murakami

Yuuki Fujimura

Ryoji Osu

Kikuo Wada

Shinji Watababe

Provided is a semiconductor device including a flexible circuit board which includes a first external electrode provided on a first face and second and third external electrodes provided on a second face; a plurality of memory devices and passive components; a supporter which is provided with a groove on one face; and a computing processor device. The memory devices and the passive components are connected to the first external electrode, the one face of the supporter is bonded on the first face of the flexible circuit board so that the groove houses the memory devices and the passive components. The flexible circuit board is bent along a perimeter of the supporter to be wrapped around a side face and another face of the supporter. On the flexible circuit board, the second external electrode is provided on the second face which is opposite to the first external electrode, and the third external electrode is provided on the second face which is bent to the another face of the supporter. The computing processor device is connected to the second external electrode, and a bump is formed on the third external electrode.

Method of manufacturing a three-dimensional packaging semiconductor device

Semiconductor device

A device having electronic components mounted therein has a first electronic component having an external terminal on a first surface and a heat spreader on a second surface, at least one second electronic component that is placed in the direction of a second surface of the first electronic component, a flexible circuit board that is electrically connected to the first electronic component and at least one second electronic component, and at least the part to which at least one second electronic component is connected is located on the second surface side of the first electronic component, and a spacer that is located between at least part of the flexible circuit board and the second surface of the first electronic component. The spacer can prevent heat from the first electronic component from being directly transferred to the second electronic component.

Device having electronic components mounted therein and method for manufacturing such device

Growing community of inventors

Shizuoka, Japan

Shizuaki Masuda