Ii-vi Delaware, Inc.

Oracle International Corporation

Finisar Corporation

Shiyun Lin

Daniel Mahgerefteh

Ashok V Krishnamoorthy

Xuezhe Zheng

Jin-Hyoung Lee

Ying Luo

John E Cunningham

Yasuhiro Matsui

Ivan Shubin

Bryan Park

Stevan S Djordjevic

Jock T Bovington

Jin Yao

Guoliang Li

Hiren D Thacker

Tsurugi Sudo

David Adams

Bernd Huebner

Gilles P Denoyer

David Bruce Young

Duanhua Kong

Brian Kim

Ding Wang

Vipul Bhatt

A spot-size converter includes first and second waveguide structures. The first waveguide structure extends longitudinally along a waveguide axis from a first end to a second end and is configured to support a first optical mode at the first end. The second waveguide structure is formed within the first waveguide structure. The second waveguide structure extends longitudinally between the first end and the second end. The second waveguide structure is configured to support a second optical mode at the second end. The second optical mode has a different diameter than the first optical mode. The second waveguide structure includes a waveguide core that has a first cross-sectional area in a first plane normal to the waveguide axis at the first end and a second cross-sectional area in a second plane normal to the waveguide axis at the second end. The second cross-sectional area is larger than the first cross-sectional area.

Spot-size converter

A system may include a wafer that includes ICs and defines cavities. Each cavity may be formed in a BEOL layer of the wafer and proximate a different IC. The system may also include an interposer that includes a transparent layer configured to permit optical signals to pass through. The interposer may also include at least one waveguide located proximate the transparent layer. The at least one waveguide may be configured to adiabatically couple at least one optical signal out of the multiple ICs. Further, the interposer may include a redirecting element optically coupled to the at least one the waveguide. The redirecting element may be located proximate the transparent layer and may be configured to receive the at least one optical signal from the at least one waveguide. The redirecting element may also be configured to vertically redirect the at least one optical signal towards the transparent layer.

Wafer level testing of optical components

In an example embodiment, a system includes a first grating-coupled laser (GCL) that includes a first laser cavity optically coupled to a first transmit grating coupler configured to redirect horizontally-propagating first light, received from the first laser cavity, vertically downward and out of the first GCL. The system also includes a second GCL that includes a second laser cavity optically coupled to a second transmit grating coupler configured to transmit second light vertically downward and out of the second GCL. The system also includes a photonic integrated circuit (PIC) that includes a first receive grating coupler optically coupled to a first waveguide and configured to receive the first light and couple the first light into the first waveguide. The PIC also includes a second receive grating coupler optically coupled to a second waveguide and configured to receive the second light and couple the second light into the second waveguide.

Dual grating-coupled lasers

In one example, an optoelectronic module may include a stack assembly including an electrical integrated circuit and an optical integrated circuit electrically and mechanically coupled to one another, an interposer electrically and mechanically coupled to the stack assembly, and an optical connector to optically couple the optical integrated circuit with an array of optical fibers.

Photonic optoelectronic module packaging

In one example, an optoelectronic assembly may include a laser array, an amplifier array, and a multimode interference coupler optically coupling the laser array and the amplifier array. The laser array may include at least one primary laser and at least one spare laser configured to be activated if the primary laser fails. The amplifier array may include at least two amplifiers configured to amplify optical signals received from the laser array.

High power laser array devices and methods

A grating coupled laser (GCL) includes an active section and a passive section. The passive section is butt coupled to the active section to form a butt joint with the active section. The active section includes an active waveguide. The passive section includes a passive waveguide, a transmit grating coupler, and a top cladding. The passive waveguide is optically coupled end to end with the active waveguide and includes a first portion and a second portion. The first portion of the passive waveguide is positioned between the second portion of the passive waveguide and the active waveguide. The transmit grating coupler is optically coupled to the passive waveguide and includes grating teeth that extend upward from the second portion of the passive waveguide. The top cladding is positioned directly above the first portion of the passive waveguide and is absent directly above at least some of the transmit grating coupler.

Grating coupled laser for Si photonics

An example system includes a grating coupled laser, a laser optical interposer (LOI), an optical isolator, and a light redirector. The grating coupled laser includes a laser cavity and a transmit grating optically coupled to the laser cavity. The transmit grating is configured to diffract light emitted by the laser cavity out of the grating coupled laser. The LOI includes an LOI waveguide with an input end and an output end. The optical isolator is positioned between the surface coupled edge emitting laser and the LOI. The light redirector is positioned to redirect the light, after the light passes through the optical isolator, into the LOI waveguide of the LOI.

Surface coupled laser and laser optical interposer

An optoelectronic assembly may include a photonic integrated circuit (PIC) with a top surface and a laser with a top surface and a bottom surface. The optoelectronic assembly may also include a housing configured to cooperate with the PIC to one or both of house and support one or more components. The housing may include a PIC mount including a first surface to interface with the top surface of the PIC, and a laser mount including a second surface to interface with the top or bottom surface of the laser. The first surface and the second surface may be parallel to each other.

Lens-less laser micro-package assembly

A system includes a grating coupled laser and a photonic integrated circuit (PIC). The grating coupled laser includes a first waveguide and a transmit grating coupler optically coupled to the first waveguide. The PIC includes a second waveguide and a receive grating coupler optically coupled to the second waveguide. The receive grating coupler is in optical alignment with the transmit grating coupler. The receive grating coupler includes a first grating and a second grating spaced apart from and above the first grating within the PIC.

Dual layer grating coupler

An adiabatic optical coupler can include: a top tapered region that includes a top taper having two top tapered sides that taper from a first end region to a top tip region, the top taper having a first length; and a bottom tapered region under the top tapered region, wherein the bottom tapered region includes a bottom taper having two bottom tapered sides that taper from the first end region to a bottom tip region, the bottom taper having a second length that is longer than the first length. Another adiabatic optical coupler can include: a tapered region that includes a taper having two tapered sides that taper from an end region to a tip region; and a sub-wavelength grating (SWG) optically coupled with the tip region. Another adiabatic optical coupler can include a combination of these two adiabatic optical couplers.

Growing community of inventors

San Diego, CA, United States of America

Shiyun Lin